ISSN 2380-4505
Vol. 2016, Issue HiTEC, 2016May 01, 2016 EDT
A 225C Geothermal Logging Tool
A 225C Geothermal Logging Tool
Marshall Soares, Randy Normann, Bruce Ohme,
Articles in Vol. 2016, Issue HiTEC, 2016
Vol. 2016, Issue HiTEC, 2016
- Developments for Copper-Graphite Composite Thermal Cores for PCBs for High-Reliability and High-Temperature RF SystemsDavid L. SaumsRobert A. Hay
- C0G and X7R Ceramic Capacitors for High Temperature ApplicationsAbhijit GuravJim MageeReggie PhillipsScott Carson
- Decapsulation of Plastic Encapsulated Microelectronics with Copper Wire BondsSubramani ManoharanChandradip PatelPatrick McCluskey
- Down-hole switching-mode power supply using a remote CA start up pulseRito MijarezAngel GomezDavid PascacioIvan MartinezRicardo Guevara
- Towards High Temperature Electronic Modules in which all Components would be attached using Silver SinteringThomas GEOFFROYJean-Christophe RIOUYves BIENVENUCorinne PONSSylvain MEILLEEric BAILLY
- Silicon-Carbide Power MOSFET Performance in High Efficiency Boost Power Processing Unit for Extreme EnvironmentsStanley A. IkpeJean-Marie LauensteinGregory A. CarrDon HunterLawrence L. LudwigWilliam WoodLinda Y. Del CastilloMohammad M. MojarradiFred FitzpatrickYuan Chen
- Method to Determine Maximum Allowable Sinterable Silver Interconnect SizeA. A. WereszczakM. C. ModugnoS. B. WatersD. J. DeVotoP. P. Paret
- A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C AmbientXin ZhaoHaotao KeYifan JiangAdam MorganYang XuDouglas C. Hopkins
- Aerospace Performances of IPDiA −250°C up to 250°C Grade Silicon CapacitorsLaurent LengignonSebastien Leruez
- HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating TemperatureHolger VogtFrank AltmannSebastian BraunYusuf CelikLothar DietrichDorothee DietzMarius van DijkStefan DreinerRalf DoeringFelix GablerAndreas GoehlichMatthias HutterMartin IhleHolger KappertNorbert KordasRainer KokozinskiFalk NaumannTorsten NowakHermann OppermannUwe PartschMatthias PetzoldFrank RoscherSven RzepkaRalph SchubertConstanze WeberMaik WiemerOlaf WittlerSteffen Ziesche
- The Design, Simulation, and Performance Characteristics of High Temperature Brushed and Brushless DC Motors, and Their Electronic ControllersHarold L. Snyder
- High Reliability Electronics for Demanding Aircraft Applications – An OverviewRoger Brewer
- Silver Sintering Paste Rendering Low Porosity Joint for High Power Die Attach ApplicationSihai ChenChristine LaBarberaNing-Cheng Lee
- Component Attachment with Pressureless Sintering for 300°C ApplicationsFang YuJinzi CuiZhangming ZhouR. Wayne JohnsonMichael C. Hamilton
- Tantalum Capacitor Technology Options for High Temperature and Harsh Environment ApplicationsChris Reynolds
- Low Power Silicon Carbide RS-485 TransceiverM. R. BenavidesA. N. CastilloA. RahmanM. BarlowD. AbreuC. RowlettH. A. MantoothA. M. FrancisJ. A. Holmes
- High temperature / radiation hardened capable ARM® Cortex®-M0 microcontrollersR. BannatyneD. GiffordK. KleinC. Merritt
- A 225C Geothermal Logging ToolMarshall SoaresRandy NormannBruce Ohme
- Effect of isothermal aging at 250 °C on shear strength of joints using Au nanoporous bonding for die attachH. NishikawaK. MatsunagaM-S. KimM. SaitoJ. Mizuno
- Processing and Characterization of Thousand-Hour 500 °C Durable 4H-SiC JFET Integrated CircuitsDavid J. SpryPhilip G. NeudeckLiang-Yu ChenDorothy LukcoCarl W. ChangGlenn M. BeheimMichael J. KrasowskiNorman F. Prokop
- A 200C capable embedded EEPROMDean AllumTomas DrajsajtlRadomir PlachejdaStanislav SeleznevRichard Wheelus
- High Temperature Potting Materials for Wire Bond EncapsulationDavid ShaddockLiang Yin
- High-Temperature Operation of Silicon Carbide CMOS Circuits for Venus Surface ApplicationA. Matthew FrancisJim HolmesNick ChiolinoMatthew BarlowAffan AbbasiH. Alan Mantooth
- Development of BiAgX® HT Solder Paste for 200°C ApplicationHongwen ZhangJonathan MinterNing-Cheng Lee
- First-Order SPICE Modeling of Extreme-Temperature 4H-SiC JFET Integrated CircuitsPhilip G. NeudeckDavid J. SpryLiang-Yu Chen
- Development of a High Temperature Interconnect Solution as an Alternative to High Lead or Gold Content SoldersMartin WickhamKate ClaytonAna RobadorChris HuntRobin PittsonLaura StattonTina BrownFiona LambertTracy Wotherspoon
- High-Temperature Self-Supplied Isolated Driver Module for GaN Power TransistorsXavier BaieVincent DessardRené EscoffierFabien LaplaceGonzalo Picun
- Encapsulation Method for Small Wireless Measurement Systems in High Temperature EnvironmentsJ. JohanssonJ. Borg
- Flip-chip Bonded SiC Power Devices on a Low Temperature Co-fired Ceramic (LTCC) Substrate for Next Generation Power ModulesSayan SealMichael D. GloverH. Alan Mantooth
- Towards Integrated Sensors for Environments with Temperatures up to 600 °CAyden MaralaniLevent BekerAlbert P. Pisano
- Nanocomposite Film Dielectrics for High Temperature Power Conditioning CapacitorsKirk SlenesDale PerryLew Bragg
- High Precision Analog Multiplexers Enable Multi-Channel Data Acquisition in High Temperature EnvironmentsJeff WatsonStephen KavanaghStephen Nugent
- Degradation Analysis of TO-247 Package SiC-MOSFETs Subjected to High Temperature Storage and Heavy Thermal Cycle TestSawa ArakiTatsuhiro SuzukiMari YamashitaSatoshi TanimotoToshiaki OnoHisashi YakumaruHiroki Sawada
- AVX High Temperature Products for Surface Mount and SMPS ApplicationsDave DuprePatrick German
- Internal Structure Refinement of Porous Sintered Silver via ElectromigrationAli MansourianSeyed Amir PaknejadQiannan WenKhalid KhtatbaAnatoly V. ZayatsSamjid H. Mannan
- Design of High Temperature Combline Band-pass Filters for Downhole CommunicationsMohammed EhteshamuddinJebreel M. SalemDong Sam Ha
- Increased High-Temperature IC Packaging Reliability Using Die Extraction and Additive Manufacturing AssemblyErick M. Spory
- A CMOS SiC Linear Voltage Regulator for High Temperature ApplicationsR.C. MurphreeS. AhmedM. BarlowA. RahmanH.A. MantoothA. M. Francis
- Toward Interpreting Failure in Sintered-Silver Interconnection Systems†M. C. ModugnoA. A. WereszczakS. B. Waters
- Improving Efficiency in Downhole Power Converters using GaN TechnologyGary Hanington
- Design and Testing of a High Temperature InverterShashank KrishnamurthyStephen SavulakYang Wang
- Electrical Performance of a High Temperature 32-I/O HTCC Alumina PackageLiang-Yu ChenPhilip G. NeudeckDavid J. SpryGlenn M. BeheimGary W. Hunter
- Co-fired Platinum High Temperature Sensor ElementTsutomu SugawaraHiroshi MatsumotoHiroki ItoShingo SatoMasanari Kokubu
- System On Chip (SOC) ASIC chipset for Smart Actuators in Distributed Propulsion SystemsBhal TulpuleAlireza R. Behbahani
- Metallic TIM Testing and Selection for Harsh Environment Applications for GaN RF SemiconductorsTim JensenDavid L. Saums
- High Temperature GaN Gate Driver in SOI CMOS TechnologyHolger KappertSebastian BraunNorbert KordasStefan DreinerRainer Kokozinski
- A High Temperature Passive GaN-HEMT Mixer for Downhole CommunicationsJebreel M. SalemDong Sam Ha
Soares, Marshall, Randy Normann, and Bruce Ohme. 2016. “A 225C Geothermal Logging Tool.” IMAPSource Proceedings 2016 (HiTEC): 28–34. https://doi.org/10.4071/2016-HITEC-28.