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High Temperature Conference Papers
Vol. 2016, Issue HiTEC, 2016May 01, 2016 EDT

HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating Temperature

Holger Vogt, Frank Altmann, Sebastian Braun, Yusuf Celik, Lothar Dietrich, Dorothee Dietz, Marius van Dijk, Stefan Dreiner, Ralf Doering, Felix Gabler, Andreas Goehlich, Matthias Hutter, Martin Ihle, Holger Kappert, Norbert Kordas, Rainer Kokozinski, Falk Naumann, Torsten Nowak, Hermann Oppermann, Uwe Partsch, Matthias Petzold, Frank Roscher, Sven Rzepka, Ralph Schubert, Constanze Weber, Maik Wiemer, Olaf Wittler, Steffen Ziesche,
High TemperatureSOI CMOSSilicon CapacitorsMEMSCeramic SubstratesPolymer CeramicLTCCWafer Level PackagingTransient Liquid Phase BondingAg SinteringReliability
https://doi.org/10.4071/2016-HITEC-1a
IMAPSource Conference Papers
Vogt, Holger, Frank Altmann, Sebastian Braun, Yusuf Celik, Lothar Dietrich, Dorothee Dietz, Marius van Dijk, et al. 2016. “HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating Temperature.” IMAPSource Proceedings 2016 (HiTEC): 1–10. https:/​/​doi.org/​10.4071/​2016-HITEC-1a.
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