ISSN 2380-4505
Vol. 2016, Issue HiTEC, 2016May 01, 2016 EDT
Development of a High Temperature Interconnect Solution as an Alternative to High Lead or Gold Content Solders
Development of a High Temperature Interconnect Solution as an Alternative to High Lead or Gold Content Solders
Martin Wickham, Kate Clayton, Ana Robador, Chris Hunt, Robin Pittson, Laura Statton, Tina Brown, Fiona Lambert, Tracy Wotherspoon,
Wickham, Martin, Kate Clayton, Ana Robador, Chris Hunt, Robin Pittson, Laura Statton, Tina Brown, Fiona Lambert, and Tracy Wotherspoon. 2016. “Development of a High Temperature Interconnect Solution as an Alternative to High Lead or Gold Content Solders.” IMAPSource Proceedings 2016 (HiTEC): 196–206. https://doi.org/10.4071/2016-HITEC-196.