ISSN 2380-4505
Vol. 2014, Issue HITEC, 2014January 01, 2014 EDT
Demonstration of SiC Pressure Sensors at 750 °C
Demonstration of SiC Pressure Sensors at 750 °C
Robert S. Okojie, Dorothy Lukco, Vu Nguyen, Ender Savrun,
Articles in Vol. 2014, Issue HITEC, 2014
Vol. 2014, Issue HITEC, 2014
- Strength and Reliability of High Temperature Transient Liquid Phase Sintered JointsS. Ali MoeiniHannes GreveF. Patrick McCluskey
- Galvanic Isolation of Logic Signals at Extreme TemperaturesIMAPSource Proceedings
- Thermo-mechanical simulation of sintered Ag die attach for high temperature applicationsM.F. SousaM.v. DijkH. WalterC. WeberM. HutterH. OppermannO. WittlerK.D. Lang
- Characterization of AgBiX™ Solder Paste on Thick Film for 200°C ApplicationsZhenzhen ShenWayne JohnsonMichael C. Hamilton
- 8-15 KV HIGH TEMPERATURE SIC PIN AND SCHOTTKY RECTIFIERSRanbir SinghSiddarth Sundaresan
- Topside Nanocrystalline Diamond Integration on AlGaN/GaN HEMTs for High Temperature OperationAndrew D. KoehlerTravis J. AndersonMarko J. TadjerTatyana I. FeygelsonJennifer K. HiteKarl D. HobartBradford B. PateFrancis J. KubCharles R. Eddy
- New Battery Possibilities for High-temperature ElectronicsAlexander A. Potanin
- 500 kHz – 5 MHz Phase-Locked Loops in High-Temperature Silicon Carbide CMOSPaul ShepherdAshfaqur RahmanShamim AhmedA Matt FrancisJim HolmesH. Alan Mantooth
- Platform for Testing Sensors in HT Geothermal WellsRandy Normann
- The Effects of Repeated Refresh Cycles on the Oxide Integrity of EEPROM Memories at High TemperatureLynn ReedVema Reddy
- Dielectric Performance of a High Purity HTCC Alumina at High Temperatures - A Comparison Study with other Polycrystalline AluminaLiang-Yu Chen
- High Temperature Dynamic Pressure Measurements Using Silicon Carbide Pressure SensorsRobert S. OkojieRoger D. MeredithClarence T. ChangEnder Savrun
- Off the shelf chip and die extraction for long term reliabilityTerence Q. Collier
- Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter LegRaphaël RIVACyril BUTTAYMarie-Laure LOCATELLIVincent BLEYBruno ALLARD
- “Has Microelectronic MCM Technology Matured and is it Capable of Servicing the Widespread Needs of Down Well 225°C Operating Applications in the Oil and Gas Industry?”Bob HuntAndy Tooke
- GaN Power Module with High Temperature Gate Driver and Insulated Power SupplyRémi PerrinDominique BergogneChristian MartinBruno Allard
- Extreme thermal resistance of all-polyimide bondlines with TPI adhesiveJim Fraivillig
- A 200 °C Quad-Output Buck Type Switched Mode Power Supply ICDaniel T. GoffSteve J. A. MajerusWalter Merrill
- Reliability and Corrosion Resistance of High Temperature Lead-Free BiAgX™ PasteHongWen ZhangRunSheng MaoNing-Cheng LeeSatoshi Tanimoto
- Highly Integrated and Isolated Universal Half-Bridge Power Gate Driver and Associated Flyback Power Supply for High Temperature and High Reliability ApplicationsDavid GrasChristophe PautrelAmir FanaeiGregory ThepautMaxime ChabertFabien LaplaceGonzalo Picun
- High Temperature Tantalum-MnO2 Capacitors: >200° CH. JassoK. TempelH. Bishop
- Demonstration of SiC Pressure Sensors at 750 °CRobert S. OkojieDorothy LukcoVu NguyenEnder Savrun
- Design Considerations for Reliable High Temperature Operation of Wet Electrolytic Tantalum CapacitorsJeremy Ladd
- Temperature dependence of high dielectric strength potting materials for medium voltage power modulesChad B. O'NealBrandon PassmoreMatthew FeurtadoJennifer StabachTy McNutt
- Development of low temperature sintered nano silver pastes using MO technology and resin reinforcing technologyKoji SasakiNoritsuka Mizumura
- Design and Assembly of High Temperature Distributed Aero-engine Control System DemonstratorS T RichesC WarnK CannonG RickardL StoicaC Johnston
- Analog and Logic High Temperature Integrated Circuits based on SiC JFETsPeter AlexandrovXueqing LiMatt O'GradyJohn Hostetler
- Using Parallel High Voltage Multipliers for 100kV Downhole Neutron Generator Power SuppliesGary Hanington
- High Temperature capable SiC Schottky diodes, based on buried grid design.Tomas HjortAdolf SchönerAndy ZhangMietek BakowskiJang-Kwon LimWlodek Kaplan
- Integrated Protection Circuits for an NMOS Silicon Carbide Gate Driver Integrated CircuitPaul ShepherdDillon KaiserMichael GloverSonia PerezA. Matt FrancisH. Alan Mantooth
- A Low Power, Precision SAR Analog to Digital Converter for High Temperature ApplicationsJeff WatsonMaithil Pachchigar
- Modeling of Thermomechanical Behaviour of Wire Bonded Electronic Devices under Combined Thermal and Vibration LoadsR. ManC. LiuM. MirgkizoudiS. Riches
- The melting-point increase of Sn-Bi solder joint by Cu particles additionOmid MokhtariHiroshi Nishikawa
- 230°C Accelerometer with Digitized Output for Directional DrillingDouglas C. MacGuganEric C. AbbottJ. Chris Milne
- High Temperature Laminate CharacterizationDavid ShaddockLiang Yin
- 500°C Silicon Carbide MOSFET-Based Integrated CircuitsCheng-Po ChenReza GhandiLiang YinXingguang ZhuLiangchun YuSteve ArthurPeter Sandvik
- A System On Chip (SOC) ASIC chipset for Aerospace and Energy Exploration ApplicationsBhal TulpuleBruce OhmeMark LarsonAl BehbahaniJohn GeretyAl Steines
- Effect of Sn Component Surface Finish on 92.5Pb-5Sn-2.5AgHarry SchoellerMartin AnselmImran KhanEric Cotts
- High Temperature 0.35 Micron Silicon-on-Insulator CMOS TechnologyHolger KappertStefan DreinerDirk DittrichKatharina GrellaAndreas KelbererMiriam KlusmannNorbert KordasAndre KosfeldAlexander SchmidtUwe PaschenRainer Kokozinski
- A 256 kbit (32kx8) EEPROM for >200°C ApplicationsDennis AdamsJeff BlackGarry CunninghamRandall LewisJason O'BrienBill HandGreg MarshIan ManwaringDonald PierceCory ShermanSze Wong
- 500 °C operation of AlGaN/GaN and AlInN/GaN Integrated CircuitsMikhail GaevskiJianyu DengGrigory SiminRemis Gaska
- Class-I and Class-II Ceramic Capacitors for High Temperature ApplicationsAbhijit GuravXilin XuJim MageeReggie PhillipsTravis Ashburn
- Stress Intensity of Delamination in a Sintered-Silver InterconnectionD. J. DeVotoP. P. ParetA. A. Wereszczak
- Nanocomposite Film Dielectrics for High Temperature Power Conditioning CapacitorsKirk SlenesLew Bragg
- A High Temperature (> 250 °C) SiC Schottky Diode Bridge Rectifier for Extreme Environment ApplicationsB. S. PassmoreJ. StabachS. StorkovD. MartinG. FallingR. ShawT. McNutt
- Enhancing Performance and Reliability of High Temperature Electronics through Thermally-Stable Parylene HTRakesh Kumar
- New Generations of Highly Integrated High Temperature DC-DC ConvertersPierre DelatteThomas FrançoisDavid BaldwinJan BeranekZlatan GradincicEtienne Vanzieleghem
- Performance and Reliability Characterization of 1200 V Silicon Carbide Power MOSFETs and JFETs at High TemperaturesJack FlickerDavid HughartRobert KaplarStanley AtcittyMatthew Marinella
- Characterization of Circuit Blocks for Configurable Analog-Front-EndBruce W. OhmeMark R. LarsonBhal TulpuleAlireza Behbahani
- Pressureless, Low Temperature Sintering of Micro-scale Silver Paste for Die Attach for 300°C ApplicationsFang YuR. Wayne JohnsonMichael Hamilton
- Uniqueness and Challenges of Sintered Silver as a Bonded Interface MaterialA. A. WereszczakZ. LiangM. K. FerberL. D. Marlino
- HPHT cased-hole CCL tool enhancement via DSP techniques for accurate depth control in wire-line well interventionsRito MijarezDavid PascacioRicardo GuevaraCarlos TelloOlimpia PachecoJoaquín Rodríguez
- High Temperature Microelectromechanical Systems Using Piezoelectric Aluminum NitrideBenjamin A. GriffinScott D. HabermehlPeggy J. Clews
- High Temperature Isolated Switch Mode Power Supply with Integrated Power and Feedback TransformerHarold L. Snyder
- HIGH TEMPERATURE HYBRID NANODIAMOND SENSOR SYSTEMSJohn R. FraleyLauren KegleyStephen MindenJimmy L. DavidsonDavid Kerns
- Stacked Ceramic Capacitors for High Temperatures (≥200°C)John BultitudeLonnie JonesJohn McConnellAbhijit Gurav
- A 200 °C Motor Control ASICSteve J. A. MajerusDaniel T. GoffWalter Merrill
- Experimental results of testing high-temperature-high-current pulsed operation of SiC MOSETs and SiC diodesSteven A. MorrisRuichen ZhaoZinovy Krugliak
Okojie, Robert S., Dorothy Lukco, Vu Nguyen, and Ender Savrun. 2014. “Demonstration of SiC Pressure Sensors at 750 °C.” IMAPSource Proceedings 2014 (HITEC): 28–32. https://doi.org/10.4071/HITEC-TA21.