ISSN 2380-4505
Vol. 2014, Issue HITEC, 2014January 01, 2014 EDT
Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter Leg
Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter Leg
Raphaël RIVA, Cyril BUTTAY, Marie-Laure LOCATELLI, Vincent BLEY, Bruno ALLARD,
Articles in Vol. 2014, Issue HITEC, 2014
Vol. 2014, Issue HITEC, 2014
- Strength and Reliability of High Temperature Transient Liquid Phase Sintered JointsS. Ali MoeiniHannes GreveF. Patrick McCluskey
- Galvanic Isolation of Logic Signals at Extreme TemperaturesIMAPSource Proceedings
- Thermo-mechanical simulation of sintered Ag die attach for high temperature applicationsM.F. SousaM.v. DijkH. WalterC. WeberM. HutterH. OppermannO. WittlerK.D. Lang
- Characterization of AgBiX™ Solder Paste on Thick Film for 200°C ApplicationsZhenzhen ShenWayne JohnsonMichael C. Hamilton
- 8-15 KV HIGH TEMPERATURE SIC PIN AND SCHOTTKY RECTIFIERSRanbir SinghSiddarth Sundaresan
- Topside Nanocrystalline Diamond Integration on AlGaN/GaN HEMTs for High Temperature OperationAndrew D. KoehlerTravis J. AndersonMarko J. TadjerTatyana I. FeygelsonJennifer K. HiteKarl D. HobartBradford B. PateFrancis J. KubCharles R. Eddy
- New Battery Possibilities for High-temperature ElectronicsAlexander A. Potanin
- 500 kHz – 5 MHz Phase-Locked Loops in High-Temperature Silicon Carbide CMOSPaul ShepherdAshfaqur RahmanShamim AhmedA Matt FrancisJim HolmesH. Alan Mantooth
- Platform for Testing Sensors in HT Geothermal WellsRandy Normann
- The Effects of Repeated Refresh Cycles on the Oxide Integrity of EEPROM Memories at High TemperatureLynn ReedVema Reddy
- Dielectric Performance of a High Purity HTCC Alumina at High Temperatures - A Comparison Study with other Polycrystalline AluminaLiang-Yu Chen
- High Temperature Dynamic Pressure Measurements Using Silicon Carbide Pressure SensorsRobert S. OkojieRoger D. MeredithClarence T. ChangEnder Savrun
- Off the shelf chip and die extraction for long term reliabilityTerence Q. Collier
- Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter LegRaphaël RIVACyril BUTTAYMarie-Laure LOCATELLIVincent BLEYBruno ALLARD
- “Has Microelectronic MCM Technology Matured and is it Capable of Servicing the Widespread Needs of Down Well 225°C Operating Applications in the Oil and Gas Industry?”Bob HuntAndy Tooke
- GaN Power Module with High Temperature Gate Driver and Insulated Power SupplyRémi PerrinDominique BergogneChristian MartinBruno Allard
- Extreme thermal resistance of all-polyimide bondlines with TPI adhesiveJim Fraivillig
- A 200 °C Quad-Output Buck Type Switched Mode Power Supply ICDaniel T. GoffSteve J. A. MajerusWalter Merrill
- Reliability and Corrosion Resistance of High Temperature Lead-Free BiAgX™ PasteHongWen ZhangRunSheng MaoNing-Cheng LeeSatoshi Tanimoto
- Highly Integrated and Isolated Universal Half-Bridge Power Gate Driver and Associated Flyback Power Supply for High Temperature and High Reliability ApplicationsDavid GrasChristophe PautrelAmir FanaeiGregory ThepautMaxime ChabertFabien LaplaceGonzalo Picun
- High Temperature Tantalum-MnO2 Capacitors: >200° CH. JassoK. TempelH. Bishop
- Demonstration of SiC Pressure Sensors at 750 °CRobert S. OkojieDorothy LukcoVu NguyenEnder Savrun
- Design Considerations for Reliable High Temperature Operation of Wet Electrolytic Tantalum CapacitorsJeremy Ladd
- Temperature dependence of high dielectric strength potting materials for medium voltage power modulesChad B. O'NealBrandon PassmoreMatthew FeurtadoJennifer StabachTy McNutt
- Development of low temperature sintered nano silver pastes using MO technology and resin reinforcing technologyKoji SasakiNoritsuka Mizumura
- Design and Assembly of High Temperature Distributed Aero-engine Control System DemonstratorS T RichesC WarnK CannonG RickardL StoicaC Johnston
- Analog and Logic High Temperature Integrated Circuits based on SiC JFETsPeter AlexandrovXueqing LiMatt O'GradyJohn Hostetler
- Using Parallel High Voltage Multipliers for 100kV Downhole Neutron Generator Power SuppliesGary Hanington
- High Temperature capable SiC Schottky diodes, based on buried grid design.Tomas HjortAdolf SchönerAndy ZhangMietek BakowskiJang-Kwon LimWlodek Kaplan
- Integrated Protection Circuits for an NMOS Silicon Carbide Gate Driver Integrated CircuitPaul ShepherdDillon KaiserMichael GloverSonia PerezA. Matt FrancisH. Alan Mantooth
- A Low Power, Precision SAR Analog to Digital Converter for High Temperature ApplicationsJeff WatsonMaithil Pachchigar
- Modeling of Thermomechanical Behaviour of Wire Bonded Electronic Devices under Combined Thermal and Vibration LoadsR. ManC. LiuM. MirgkizoudiS. Riches
- The melting-point increase of Sn-Bi solder joint by Cu particles additionOmid MokhtariHiroshi Nishikawa
- 230°C Accelerometer with Digitized Output for Directional DrillingDouglas C. MacGuganEric C. AbbottJ. Chris Milne
- High Temperature Laminate CharacterizationDavid ShaddockLiang Yin
- 500°C Silicon Carbide MOSFET-Based Integrated CircuitsCheng-Po ChenReza GhandiLiang YinXingguang ZhuLiangchun YuSteve ArthurPeter Sandvik
- A System On Chip (SOC) ASIC chipset for Aerospace and Energy Exploration ApplicationsBhal TulpuleBruce OhmeMark LarsonAl BehbahaniJohn GeretyAl Steines
- Effect of Sn Component Surface Finish on 92.5Pb-5Sn-2.5AgHarry SchoellerMartin AnselmImran KhanEric Cotts
- High Temperature 0.35 Micron Silicon-on-Insulator CMOS TechnologyHolger KappertStefan DreinerDirk DittrichKatharina GrellaAndreas KelbererMiriam KlusmannNorbert KordasAndre KosfeldAlexander SchmidtUwe PaschenRainer Kokozinski
- A 256 kbit (32kx8) EEPROM for >200°C ApplicationsDennis AdamsJeff BlackGarry CunninghamRandall LewisJason O'BrienBill HandGreg MarshIan ManwaringDonald PierceCory ShermanSze Wong
- 500 °C operation of AlGaN/GaN and AlInN/GaN Integrated CircuitsMikhail GaevskiJianyu DengGrigory SiminRemis Gaska
- Class-I and Class-II Ceramic Capacitors for High Temperature ApplicationsAbhijit GuravXilin XuJim MageeReggie PhillipsTravis Ashburn
- Stress Intensity of Delamination in a Sintered-Silver InterconnectionD. J. DeVotoP. P. ParetA. A. Wereszczak
- Nanocomposite Film Dielectrics for High Temperature Power Conditioning CapacitorsKirk SlenesLew Bragg
- A High Temperature (> 250 °C) SiC Schottky Diode Bridge Rectifier for Extreme Environment ApplicationsB. S. PassmoreJ. StabachS. StorkovD. MartinG. FallingR. ShawT. McNutt
- Enhancing Performance and Reliability of High Temperature Electronics through Thermally-Stable Parylene HTRakesh Kumar
- New Generations of Highly Integrated High Temperature DC-DC ConvertersPierre DelatteThomas FrançoisDavid BaldwinJan BeranekZlatan GradincicEtienne Vanzieleghem
- Performance and Reliability Characterization of 1200 V Silicon Carbide Power MOSFETs and JFETs at High TemperaturesJack FlickerDavid HughartRobert KaplarStanley AtcittyMatthew Marinella
- Characterization of Circuit Blocks for Configurable Analog-Front-EndBruce W. OhmeMark R. LarsonBhal TulpuleAlireza Behbahani
- Pressureless, Low Temperature Sintering of Micro-scale Silver Paste for Die Attach for 300°C ApplicationsFang YuR. Wayne JohnsonMichael Hamilton
- Uniqueness and Challenges of Sintered Silver as a Bonded Interface MaterialA. A. WereszczakZ. LiangM. K. FerberL. D. Marlino
- HPHT cased-hole CCL tool enhancement via DSP techniques for accurate depth control in wire-line well interventionsRito MijarezDavid PascacioRicardo GuevaraCarlos TelloOlimpia PachecoJoaquín Rodríguez
- High Temperature Microelectromechanical Systems Using Piezoelectric Aluminum NitrideBenjamin A. GriffinScott D. HabermehlPeggy J. Clews
- High Temperature Isolated Switch Mode Power Supply with Integrated Power and Feedback TransformerHarold L. Snyder
- HIGH TEMPERATURE HYBRID NANODIAMOND SENSOR SYSTEMSJohn R. FraleyLauren KegleyStephen MindenJimmy L. DavidsonDavid Kerns
- Stacked Ceramic Capacitors for High Temperatures (≥200°C)John BultitudeLonnie JonesJohn McConnellAbhijit Gurav
- A 200 °C Motor Control ASICSteve J. A. MajerusDaniel T. GoffWalter Merrill
- Experimental results of testing high-temperature-high-current pulsed operation of SiC MOSETs and SiC diodesSteven A. MorrisRuichen ZhaoZinovy Krugliak
RIVA, Raphaël, Cyril BUTTAY, Marie-Laure LOCATELLI, Vincent BLEY, and Bruno ALLARD. 2014. “Design and Manufacturing of a Double-Side Cooled, SiC Based, High Temperature Inverter Leg.” IMAPSource Proceedings 2014 (HITEC): 372–77. https://doi.org/10.4071/HITEC-THA27.