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Device Packaging Conference Presentations
Vol. 2015, Issue DPC, 2015January 01, 2015 EDT

Heterogeneous Integration and Micromachining Technologies for Terahertz Devices and Components

Robert M. Weikle, N. Scott Barker, Arthur W. Lichtenberger, Matthew F. Bauwens, Naser Alijabbari,
Micromachining Terahertz Integration
• https://doi.org/10.4071/2015DPC-tha31
IMAPSource Conference Papers
Weikle, Robert M., N. Scott Barker, Arthur W. Lichtenberger, Matthew F. Bauwens, and Naser Alijabbari. 2015. “Heterogeneous Integration and Micromachining Technologies for Terahertz Devices and Components.” IMAPSource Proceedings 2015 (DPC): 2041–81. https://doi.org/10.4071/2015DPC-tha31.
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