ISSN 2380-4505
Articles in Vol. 2017, Issue S1, 2017
Vol. 2017, Issue S1, 2017
- Packaging without the Package - A More Holistic Moore's LawSubramanian S. Iyer (Subu)
- Electronics Outside the Box: Building a Manufacturing Ecosystem for Flexible Hybrid ElectronicsBenjamin Leever
- Transforming Electronic InterconnectTim Olson
- Packaging Challenges for the Next Generation of Mobile DevicesAhmer Syed
Olson, Tim. 2017. “Transforming Electronic Interconnect.” IMAPSource Proceedings 2017 (S1): 80–108. https://doi.org/10.4071/isom-2017-slide-4.