ISSN 2380-4505
Vol. 2017, Issue S1, 2017October 01, 2017 EDT
Electronics Outside the Box: Building a Manufacturing Ecosystem for Flexible Hybrid Electronics
Electronics Outside the Box: Building a Manufacturing Ecosystem for Flexible Hybrid Electronics
Articles in Vol. 2017, Issue S1, 2017
Vol. 2017, Issue S1, 2017
- Packaging without the Package - A More Holistic Moore's LawSubramanian S. Iyer (Subu)
- Electronics Outside the Box: Building a Manufacturing Ecosystem for Flexible Hybrid ElectronicsBenjamin Leever
- Transforming Electronic InterconnectTim Olson
- Packaging Challenges for the Next Generation of Mobile DevicesAhmer Syed
Leever, Benjamin. 2017. “Electronics Outside the Box: Building a Manufacturing Ecosystem for Flexible Hybrid Electronics.” IMAPSource Proceedings 2017 (S1): 37–80. https://doi.org/10.4071/isom-2017-slide-3.