ISSN 2380-4505
Vol. 2017, Issue S1, 2017October 01, 2017 EDT
Packaging without the Package - A More Holistic Moore’s Law
Packaging without the Package - A More Holistic Moore’s Law
Articles in Vol. 2017, Issue S1, 2017
Vol. 2017, Issue S1, 2017
- Packaging without the Package - A More Holistic Moore's LawSubramanian S. Iyer (Subu)
- Electronics Outside the Box: Building a Manufacturing Ecosystem for Flexible Hybrid ElectronicsBenjamin Leever
- Transforming Electronic InterconnectTim Olson
- Packaging Challenges for the Next Generation of Mobile DevicesAhmer Syed
Iyer (Subu), Subramanian S. 2017. “Packaging without the Package - A More Holistic Moore’s Law.” IMAPSource Proceedings 2017 (S1): 1–40. https://doi.org/10.4071/isom-2017-slide-2.