ISSN 2380-4505
Vol. 2017, Issue S1, 2017October 01, 2017 EDT
Packaging Challenges for the Next Generation of Mobile Devices
Packaging Challenges for the Next Generation of Mobile Devices
Articles in Vol. 2017, Issue S1, 2017
Vol. 2017, Issue S1, 2017
- Packaging without the Package - A More Holistic Moore's LawSubramanian S. Iyer (Subu)
- Electronics Outside the Box: Building a Manufacturing Ecosystem for Flexible Hybrid ElectronicsBenjamin Leever
- Transforming Electronic InterconnectTim Olson
- Packaging Challenges for the Next Generation of Mobile DevicesAhmer Syed
Syed, Ahmer. 2017. “Packaging Challenges for the Next Generation of Mobile Devices.” IMAPSource Proceedings 2017 (S1): 1–23. https://doi.org/10.4071/isom-2017-slide-1.