ISSN 2380-4505
Vol. 2022, Issue HiTEN, 2022November 07, 2023 EDT
Composite soldering materials for high-temperature stable solder joints
Composite soldering materials for high-temperature stable solder joints
Articles in Vol. 2022, Issue HiTEN, 2022
Vol. 2022, Issue HiTEN, 2022
- Unveiling High Performance Solder Alloys for Automotive ApplicationsPritha ChoudhuryRaghu Raj RangarajuMorgana RibasSiuli Sarkar
- Sensor Systems for Extremely Harsh EnvironmentsHolger KappertSebastian SchopfererNooshin SaeidiRalf DöringSteffen ZiescheAlexander OlowinskyFalk NaumannMartin JägleMalte SpanierAnton Grabmaier
- Recent Trends in High Reliability Timing and Frequency Control Devices for Extreme Environment ApplicationsKouros Sariri
- Recent Developments in CTE-Matched Composite Thermal MaterialsDavid L. Saums
- Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment ApplicationsLiang-Yu ChenPhilip G. NeudeckDavid J. SpryGary W. Hunter
- Location dependent down-rating of voids in high power solder connections for automotive power modulesBettina OttingerSimon MurkSebastian KönigAntonio ZangarroMichael J. MüllmaierDr. Lars MüllerProf. Dr. Jörg Franke
- Investigation of using BSPT for ring-dot piezoelectric transformers for use in high-temperature resonant power suppliesJack ForresterLinhao LiJonathan N. DavidsonMartin P. FosterDavid A. StoneIan M. ReaneyDerek C. Sinclair
- Investigation of Key Parameters for Syringe-printing of Nano-silver PasteHe YunPatrick McCluskey
- In Situ Reduction-Sintering to Produce Copper Interconnects for High Temperature ElectronicsYang ZuoSamjid H. Mannan
- High temperature operation of Beta-Ga2O3 transistorsAhmad E. IslamNicholas P. SepelakKyle J. LiddyRachel KahlerJeremiah WilliamsDaniel M. DrydenAndrew J. GreenKelson D. Chabak
- High Temperature Inertial Navigation Sensors, Electronics and Packaging for reliable 300°C OperationEmad AndarawisDavid ShaddockJeremy PoppDavid Lin
- Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal SubstrateBongmin JeongKirak SonAesun OhGawon LeeHyuncheol Bae
- GREEN CHEMISTRY FOR PROTECTION OF HIGH TEMPERATURE (> 250°C) ELECTRONICSJochen Schuermans
- Extended Lifetime Testing of SiC CMOS Electronics at 500°CEmad AndarawisCheng-Po (Paul) ChenJeremy PoppLiang YinDavid Shaddock
- Direct Write Extreme Environment PackagingDavid ShaddockCathleen HoelJared HaleMark PoliksMohammed AlhendiFiras Alshatnawi
- Diamond Electronics and Related Wideband Gap Semiconductors for High Temperature ApplicationsAris Christou
- Designs of ultra-HPHT Electrical Component Packages for Downhole and Geothermal Wellbore Logging Tool IntegrationsHua XiaDavid DeWire
- Composite soldering materials for high-temperature stable solder jointsAndrej NovikovMathias Nowottnick
- Bonding with brazing alloys as high-temperature interconnection filler through self-propagating exothermic reactionCanyu LiuZhaoxia ZhouChangqing Liu
- AlScN-on-SiC Diaphragm Multimode Micromechanical Resonators for High-Temperature Sensing ApplicationsWen SuiHaoran WangJaesung LeeAfzaal QamarMina Rais-ZadehPhilip X.-L. Feng
- AlGaN High Electron Mobility Transistor for High Temperature LogicB.A. KleinA.A. AllermanA.G. BacaC.D NordquistA.M. ArmstrongM. Van HeukelomA. RiceV. PatelM. RosprimL. CaravelloR. DeBerryJ.R. PipkinV.M. AbateR.J. Kaplar
- A Drop-in High-Temperature Pb-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete ApplicationsHongwen ZhangTyler RichmondSamuel LytwynecTybarius HarterDiego Prado
Novikov, Andrej, and Mathias Nowottnick. 2023. “Composite Soldering Materials for High-Temperature Stable Solder Joints.” IMAPSource Proceedings 2022 (HiTEN): 24–30. https://doi.org/10.4071/001c.89683.