This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:37505/feed
ISSN 2380-4505
High Temperature Conference Papers
Vol. 2022, Issue HiTEN, 2022November 07, 2023 EDT

Extended Lifetime Testing of SiC CMOS Electronics at 500°C

Emad Andarawis, Cheng-Po (Paul) Chen, Jeremy Popp, Liang Yin, David Shaddock,
High temperature electronicsSiC CMOS electronicsSiC Integrated circuits
https://doi.org/10.4071/001c.89941
IMAPSource Conference Papers
Andarawis, Emad, Cheng-Po (Paul) Chen, Jeremy Popp, Liang Yin, and David Shaddock. 2023. “Extended Lifetime Testing of SiC CMOS Electronics at 500°C.” IMAPSource Proceedings 2022 (HiTEN): 54–58. https:/​/​doi.org/​10.4071/​001c.89941.

View more stats

Powered by Scholastica, the modern academic journal management system