ISSN 2380-4505
Vol. 2022, Issue HiTEN, 2022October 31, 2023 EDT
Sensor Systems for Extremely Harsh Environments
Sensor Systems for Extremely Harsh Environments
Articles in Vol. 2022, Issue HiTEN, 2022
Vol. 2022, Issue HiTEN, 2022
- Unveiling High Performance Solder Alloys for Automotive ApplicationsPritha ChoudhuryRaghu Raj RangarajuMorgana RibasSiuli Sarkar
- Sensor Systems for Extremely Harsh EnvironmentsHolger KappertSebastian SchopfererNooshin SaeidiRalf DöringSteffen ZiescheAlexander OlowinskyFalk NaumannMartin JägleMalte SpanierAnton Grabmaier
- Recent Trends in High Reliability Timing and Frequency Control Devices for Extreme Environment ApplicationsKouros Sariri
- Recent Developments in CTE-Matched Composite Thermal MaterialsDavid L. Saums
- Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment ApplicationsLiang-Yu ChenPhilip G. NeudeckDavid J. SpryGary W. Hunter
- Location dependent down-rating of voids in high power solder connections for automotive power modulesBettina OttingerSimon MurkSebastian KönigAntonio ZangarroMichael J. MüllmaierDr. Lars MüllerProf. Dr. Jörg Franke
- Investigation of using BSPT for ring-dot piezoelectric transformers for use in high-temperature resonant power suppliesJack ForresterLinhao LiJonathan N. DavidsonMartin P. FosterDavid A. StoneIan M. ReaneyDerek C. Sinclair
- Investigation of Key Parameters for Syringe-printing of Nano-silver PasteHe YunPatrick McCluskey
- In Situ Reduction-Sintering to Produce Copper Interconnects for High Temperature ElectronicsYang ZuoSamjid H. Mannan
- High temperature operation of Beta-Ga2O3 transistorsAhmad E. IslamNicholas P. SepelakKyle J. LiddyRachel KahlerJeremiah WilliamsDaniel M. DrydenAndrew J. GreenKelson D. Chabak
- High Temperature Inertial Navigation Sensors, Electronics and Packaging for reliable 300°C OperationEmad AndarawisDavid ShaddockJeremy PoppDavid Lin
- Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal SubstrateBongmin JeongKirak SonAesun OhGawon LeeHyuncheol Bae
- GREEN CHEMISTRY FOR PROTECTION OF HIGH TEMPERATURE (> 250°C) ELECTRONICSJochen Schuermans
- Extended Lifetime Testing of SiC CMOS Electronics at 500°CEmad AndarawisCheng-Po (Paul) ChenJeremy PoppLiang YinDavid Shaddock
- Direct Write Extreme Environment PackagingDavid ShaddockCathleen HoelJared HaleMark PoliksMohammed AlhendiFiras Alshatnawi
- Diamond Electronics and Related Wideband Gap Semiconductors for High Temperature ApplicationsAris Christou
- Designs of ultra-HPHT Electrical Component Packages for Downhole and Geothermal Wellbore Logging Tool IntegrationsHua XiaDavid DeWire
- Composite soldering materials for high-temperature stable solder jointsAndrej NovikovMathias Nowottnick
- Bonding with brazing alloys as high-temperature interconnection filler through self-propagating exothermic reactionCanyu LiuZhaoxia ZhouChangqing Liu
- AlScN-on-SiC Diaphragm Multimode Micromechanical Resonators for High-Temperature Sensing ApplicationsWen SuiHaoran WangJaesung LeeAfzaal QamarMina Rais-ZadehPhilip X.-L. Feng
- AlGaN High Electron Mobility Transistor for High Temperature LogicB.A. KleinA.A. AllermanA.G. BacaC.D NordquistA.M. ArmstrongM. Van HeukelomA. RiceV. PatelM. RosprimL. CaravelloR. DeBerryJ.R. PipkinV.M. AbateR.J. Kaplar
- A Drop-in High-Temperature Pb-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete ApplicationsHongwen ZhangTyler RichmondSamuel LytwynecTybarius HarterDiego Prado
Kappert, Holger, Sebastian Schopferer, Nooshin Saeidi, Ralf Döring, Steffen Ziesche, Alexander Olowinsky, Falk Naumann, Martin Jägle, Malte Spanier, and Anton Grabmaier. 2023. “Sensor Systems for Extremely Harsh Environments.” IMAPSource Proceedings 2022 (HiTEN): 1–13. https://doi.org/10.4071/001c.89680.