ISSN 2380-4505
Vol. 2016, Issue CICMT, 2016May 01, 2016 EDT
LTCC Thick Film Process Characterization
LTCC Thick Film Process Characterization
M. A. Girardi, K. A. Peterson, P. T. Vianco,
Articles in Vol. 2016, Issue CICMT, 2016
Vol. 2016, Issue CICMT, 2016
- Advanced DBC - Highly Reliable and Conductive Copper Ceramic SubstratesPaul GundelAnton MiricKai HerbstMelanie BawohlJessica ReitzChristina ModesGabriel ZierIlias NikolaidisMark Challingsworth
- Multilayer Ferrite Inductor Substrate for Ceramic-Based High Current Point-of-Load (POL) ConverterWenli ZhangYipeng SuFred C. Lee
- RF Sensor Modules – Needs for Multifunctional ArchitecturesMartin OppermannFelix ThurowRalf Rieger
- Fabrication, response and stability of miniature piezoresistive force-sensing thick-film cantileversThomas MaederCaroline JacqStefane CaseiroPeter Ryser
- Fabrication of an RF-MEMS-Switch on a hybrid Si-Ceramic substrateS. GroppM. FischerA. FrankC. SchäffelJ. MüllerM. Hoffmann
- Design of a Low Inductance Power Module Based on Low Temperature Co-fired CeramicAtanu DuttaSimon S. Ang
- Stereolithographic Additive Manufacturing of Bulky Ceramic Components with Functionally Geometric MicropatternSoshu Kirihara
- LTCC Thick Film Process CharacterizationM. A. GirardiK. A. PetersonP. T. Vianco
- LTCC Breakdown Voltage InvestigationMateusz DorczynskiWiktoria FabinskaHenryk RoguszczakLeszek Golonka
- Microwave Filter Design Optimized for Ceramic Multilayer TechniquePeter UhligJuergen KassnerCarsten GuennerElke Noack
- Adaption of Functional Ceramic Materials for the Laser Sintering Process in Integrated Sensor ApplicationsRena GradmannThomas SeutheChristian VedderMarkus EbersteinUwe Partsch
- Fabrication of LTCC Micro-fluidic Devices For Wireless Lab-On-A-Chip ApplicationsAchraf Ben AmarHoussem Eddine AmorHung CaoAmmar B. Kouki
- LTCC 3D MICROMIXERS FOR NON-MISCIBLE FLUIDS MICROEMULSION GENERATIONHouari Cobas GomezBianca Oliveira AgioJéssica Gonçalves da SilvaNatalia Neto Pereira CerizeAdriano Marim de OliveiraKleber Lanigra GuimaraesMarcio Rodrigues da CunhaAntonio Carlos SeabraMario Ricardo Gongora-Rubio
- High Resolution LTCC Laser Processing in the Green and Fired State for Future TechnologiesNam GutzeitTilo WelkerKarl-Heinz DrüeJens Müller
- A comparative study on four different transmission lines in LTCC for 60 GHz applicationsA. IsapourD. BahloulA. B. Kouki
- Sensor stack for Tian-Calvet Calorimeter made in LTCC-TechnologyFranz SchubertJaroslaw KitaMichael GollnerFlorian LinseisRalf Moos
- Design and Fabrication of Ceramic Microsystem Utilizing Glow Discharge for Analysis of Liquid MixturesJan MacioszczykMonika LenartowiczKarol MalechaLeszek J. Golonka
- Integrated Microchannel Cooling for Power Electronic ModulesWenli ZhangFengchang YangRui QiaoDushan Boroyevich
- High-Temperature Dielectric Materials from Atomically-Thin PerovskitesMinoru OsadaTakayoshi Sasaki
- Material Integration for Flexible Electronics for Energy Application Using Nanoparticulated Dense and Stress-Free Ceramic Thick FilmYoshihiko ImanakaHideyuki AmadaFumiaki KumasakaNaoki Awaji
- Solutions for thermally mismatched brazing operations for ceramic tokamak magnetic sensorCaroline JacqThomas MaederBenoit R. EllenriederPhilipp WindischhoferXinyue JiangMatthieu ToussaintDuccio TestaPeter Ryser
- Stereolithographic Additive Manufacturing of Solid Electrolyte Ceramic Sheets with Micro Emboss Pattern for All Solid Battery ApplicationKoki NonakaSoshu Kirihara
- Evaluation of screen-printable type S (Pt-PtRh) thermocouples on different ceramic substratesJaroslaw KitaSven WiegärtnerAlistair PrincePeter WeigandRalf Moos
- The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) using Low Temperature Co-fired Ceramic InterposerSayan SealMichael D. GloverH. Alan Mantooth
- Flexible Thin Film Coating by Photo-assisted Chemical Solution ProcessTetsuo TsuchiyaT. NakajimaI. YamaguchiH. MatusiT. Nakamura
- The Effect of Firing Temperature on Structure and Electrical Properties in Low Temperature Co-fired CeramicsJim WalkerJohn MaloneyCody GleasonJeff HolthusBradford SmithJim HenryEd GraddySid SridharanGeorge Sakoske
- A Unified ASIC and LTCC Module Design Kit for High-Temperature High-Density CircuitsJim HolmesA. Matthew FrancisIan GetreuMichael Glover
- Investigations of Metal Systems in a Silicon Ceramic Composite Substrate for Electrical and Thermal Contacts as well as Associated Mounting AspectsM. FischerT. WelkerB. LeistritzS. GroppC. SchäffelM. HoffmannJ. Müller
- Microwave Characterization of a Thick Film System for Hybrid Packaging ApplicationsBradley A. ThrasherMichael A. SkurskiKen E. SoudersJames M. Parisi
- MEMS Fabrication on LTCC Substrates for RF Applications: Challenges and PerspectivesDorra BahloulAchraf Ben AmarAmmar B. Kouki
- Thermodynamic Analysis of Physical Vapor Deposition (PVD) Inorganic Thin Films on Low Temperature Cofired Ceramic (LTCC)Carol PutmanRachel Cramm HornAmbrose WolfDaniel Krueger
- LTCC 3D FLOW FOCALIZATION DEVICE FOR LIQUID-LIQUID PARTIAL SOLVENT EXTRACTIONHouari Cobas GomezJéssica Gonçalves da SilvaJocasta Mileski MachadoBianca Oliveira AgioFrancisco Jorge Soares de OliveiraAntonio Carlos SeabraMario Ricardo Gongora-Rubio
- Wire-bondable multilayer ceramic capacitorsYan GuYilong FengJunfeng YangZhifu LiuTong ZhuangYongxiang Li
- Novel Glass-free LTCC Material co-fired with Cupper-ElectrodesYasutaka SugimotoTsuyoshi KatsubeMachiko MotoyaYuki TakemoriYoichi MoriyaKazuo KishidaTakahiro TakadaNobuhiko Tanaka
Girardi, M. A., K. A. Peterson, and P. T. Vianco. 2016. “LTCC Thick Film Process Characterization.” IMAPSource Proceedings 2016 (CICMT): 142–50. https://doi.org/10.4071/2016CICMT-WP13.