Vol. 2016, Issue CICMT, 2016May 01, 2016 EDT
A Unified ASIC and LTCC Module Design Kit for High-Temperature High-Density Circuits
A Unified ASIC and LTCC Module Design Kit for High-Temperature High-Density Circuits
Jim Holmes, A. Matthew Francis, Ian Getreu, Michael Glover,
Holmes, Jim, A. Matthew Francis, Ian Getreu, and Michael Glover. 2016. “A Unified ASIC and LTCC Module Design Kit for High-Temperature High-Density Circuits.” IMAPSource Proceedings 2016 (CICMT): 169–72. https://doi.org/10.4071/2016CICMT-WP43.