ISSN 2380-4505
Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT
Microstructural Evolution and Thermal Stability Characterization of a High Temperature Die Attach Lead-Free System
Microstructural Evolution and Thermal Stability Characterization of a High Temperature Die Attach Lead-Free System
Rogie I. Rodriguez, Dimeji Ibitayo, Pedro Quintero,
Articles in Vol. 2012, Issue HITEC, 2012
Vol. 2012, Issue HITEC, 2012
- Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment ElectronicsM. MirgkizoudiC. LiuP. ConwayS. Riches
- Determination of the Creep Properties of Pb-free Solders for Harsh Environments Using Meso-scale TestingS. Godard DesmarestC. JohnstonP. S. Grant
- Investigation of Thick Film Technology for High Temperature ApplicationsZhangming ZhouJinzi CuiFang YuKun FangZhenzhen ShenR. Wayne JohnsonAlexey VertTan ZhangDavid Shaddock
- SOI-Based Integrated Gate Driver Circuit for High-Temperature ApplicationsR. L. GreenwellB.M. McCueM.I. LaurenceC.L. FandrichB.J. BlalockL.M. TolbertS.K. Islam
- SOI Based Voltage Regulator for High-Temperature ApplicationsB. M. McCueR. L. GreenwellM. I. LaurenceB. J. BlalockS. K. IslamL. M. Tolbert
- Pressureless Sintering Progression of a Silver Nanoparticle Attach Material Via Micrographic AnalysisManuel MolinaAndrés VelascoWilfredo OtañoPedro O. Quintero
- Development of Low RON,Diff, 12 kV, 4H-SiC GTOs For High-Power and High-Temperature ApplicationsLin ChengAnant K. AgarwalMichael OloughlinAl BurkCraig CapellKhiem LamJon ZhangJim RichmondJohn PalmourVictor TempleAderinto A. OgunniyiHeather K. O'BrienCharles J. Scozzie
- Silicon Carbide High Temperature Operational AmplifierAlexey VertCheng-Po ChenAmita PatilRich SaiaEmad AndarawisAvinash KashyapTan ZhangDave ShaddockZhenzhen ShenR. Wayne JohnsonRandy Normann
- Optimization of a Ceramic Circuit Board ClampDavid A. GlowkaRandy A. Normann
- Microstructural Evolution and Thermal Stability Characterization of a High Temperature Die Attach Lead-Free SystemRogie I. RodriguezDimeji IbitayoPedro Quintero
- High-Temperature Reliability of Direct-Bond-Copper Substrates with Sealed EdgesYiying YaoZheng ChenDushan BoroyevichKhai D. T. Ngo
- SILICON CARBIDE “SUPER” JUNCTION TRANSISTORS OPERATING AT 500 °CSiddarth SundaresanRanbir SinghR. Wayne Johnson
- Digital and Analogue Integrated Circuits in Silicon Carbide for High Temperature OperationE.P RamsayD.T. ClarkJ.D. CormackA.E. MurphyD.A SmithR.F. ThompsonR.A.R. YoungS. Finney
- SMD and Leaded Ceramic Capacitors for High Temperature ApplicationsAbhijit GuravXilin XuJim MageeJohn BultitudeTravis Ashburn
- SLID Bonding for Energy Dense Applications – Thermo-MechanicsAndreas LarssonTorleif André Tollefsen
- Communications System using a 1K22Monoconductor Cable for Down-hole Measurement ToolsRito MijarezDavid PascacioRicardo GuevaraJoaquín RodríguezOlimpia Pacheco
- Analog Component Development for 300°C Sensor Interface ApplicationsBruce W. OhmeMark R. Larson
- Silicon Capacitors with extremely high stability and reliability ideal for high temperature applicationsCatherine BunelLaurent Lengignon
- Electrical Performance of Co-Fired Alumina Substrates at High TemperaturesLiang-Yu Chen
- Highly Reliable Double-sided Bonding used in Double-sided Cooling for High Temperature Power ElectronicsSang Won YoonMichael D. GloverH. Alan MantoothKoji Shiozaki
- Extreme Thermal Transient Stress Analysis with Pre-Stress in a Metal Matrix Composite Power PackageDouglas C. HopkinsTheodore BaltisJames M PitaressDonald R. Hazelmyer
- Recent Progress in Thin Film Multichip Packaging for High Temperature Digital ElectronicsKun FangTami Isaacs-SmithR. Wayne JohnsonAlexey VertTan ZhangDavid Shaddock
- An Ultra-Low Noise Instrumentation Amplifer Designed for High Temperature ApplicationsJeff WatsonGustavo Castro
- Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength ReliabilitySatoshi TanimotoKohei MatsuiYusuke ZushiShinji SatoYoshinori MurakamiMasato TakamoriTakashi Iseki
- A High Current (>1500A) Power Module for High Temperature, High Performance Applications Using SiC TMOS Power SwitchesB. PassmoreJ. HornbergerB. McPhersonJ. BourneR. ShawE. CilioW. CilioB. ReeseT. McNuttM. SchupbachA.B. Lostetter
- High Temperature Ageing of Fe-based Nanocrystalline RibbonsChristian MartinRémi RobutelCyril ButtayFabien SixdenierPascal BevilacquaHervé MorelRégis Meuret
- DM300 - A 300°C Geothermal Directional Module DevelopmentD MacGugan
- Temperature Induced Voltage Offset Drifts in Silicon Carbide Pressure SensorsR.S. OkojieD. LukcoV. NguyenE. Savrun
- An Airborne High Temperature SiC Power Converter for Medium Power Smart Electro Mechanical ActuatorsDominique BergogneFabien DuboisChristian MartinKhalil El FalahiLuong Viet PhungCyril ButtaySonia DhokkarBruno AllardRégis MeuretHervé Morel
- High-Temperature Versatile Voltage-Mode PWM ControllerFabien LaplaceXavier MontmayeurJérôme ThomasGonzalo Picun
- Updated Analysis of Circuit Reliability Test ResultsMilton Watts
- A Drop-in Die-Attach Solution for the High Temperature Lead-Free BiAgX Solder Paste SystemHongWen ZhangNing-Cheng Lee
- Transient Liquid Phase Soldering for lead-free joining of power electronic modules in high temperature applicationsChristian EhrhardtMatthias HutterHermann OppermannKlaus-Dieter Lang
- Investigation of Photo-Imageable Thick Film Metallization on Low Temperature Cofired Ceramics (LTCC) for Improved Packaging DensityZhenzhen ShenR. Wayne JohnsonTan ZhangDavid Shaddock
- High temperature anti short circuit function for normally-on SiC JFET in an inverter leg configurationKhalil El FalahiLuong Viêt PhungBruno AllardDominique BergogneFabien Dubois
- Characterization and Reliability of custom digital ASIC designs using a 0.8μm bulk CMOS process for high temperature applicationsMark WattsShane Rose
- Reliability of electronics assembled using SAC + Zn solder pastesH.R. KotadiaA. PanneerselvamM.A. GreenM.P. ClodeS.H. MannanH. Steen
- High Temperature Performance of Coiled Glass CapacitorsEugene FurmanAmanda BakerSteve PeriniMohan MonoharanDouglas KushnerNanyan ZhangChen ZouCharles MiShihai ZhangTakashi MurataMichael Lanagan
- Characterization of the Vectron PX-570 Crystal Oscillator for Use in Harsh EnvironmentsJacob LiRichard L. PattersonAhmad Hammoud
- Nanocomposite Film Dielectrics for High Temperature Power Conditioning CapacitorsKirk SlenesLew Bragg
- Modeling of the Punch-Through Effect in Normally-On SiC JFET used in High Temperature Inverter for Aerospace ApplicationFabien DuboisHervé MorelDominique BergogneRégis Meuret
- Thermal Stress Reliability Study on Substrates for High Temperature, Silicon Carbide Power Electronic ModulesR. ShawP. DoyleJ. HornbergerA. LostetterB. McPhersonH. ProcellR. Schupbach
- A Design Paradigm to Facilitate Multiple Parts from a Single Silicon DesignRichard N. Rea
- Characterization and Reliability Testing on an LTCC Transformer Operable to 250 °CJames GalipeauGeorge Slama
- Characteristics of High Temperature Switch Mode Power SuppliesHarold L. Snyder
- Large-area Nanosilver Die-attach by Hot-pressing Below 200°C and 5 MPaKewei XiaoJesus N. CalataHanguang ZhengKhai D.T. NgoGuo-Quan Lu
- High Temperature Analog-to-Digital Converter Reliability TestingBruce W. OhmeMark R. Larson
- VEGA & RIGEL: New tiny high temperature adjustable voltage regulators for reduced PCB footprint and extended reliability of medium and high temperature systemsPierre DelatteEtienne VanzieleghemThomas FrançoisJean-Christophe Doucet
- Characterization of a Large Area Silicon Carbide PiN Diode at Temperatures up to 900°CJim RichmondLin ChengAnant AgarwalJohn Palmour
- High-Temperature, Bulk-CMOS Integrated Circuits for a Distributed Control System-Performance ResultsDan HoweSteve MajerusSteve GarverickWalter MerrillKen Semega
- High Power Lithium Primary Cells for High Temperature Downhole ApplicationsArden P. JohnsonJohn S. MillerYufei Wang
- A High Temp standalone 4MByte Flash memory with SPI Interface for 210C applicationsWade VonBergenMadhu Basude
- A Cyclic RSD Analog-Digital-Converter for Application Specific High Temperature Integrated Circuits up to 250°CAlexander SchmidtHolger KappertWolfgang HeiermannRainer Kokozinski
- End of Life Failure Modes for Packaged SOI Devices for Signal Conditioning and Processing ApplicationsS T RichesC JohnstonA CrossleyP Grant
- High Temperature Characterization up to 450 °C of MOSFETs and basic circuits realized in a Silicon-on-Insulator (SOI) CMOS-TechnologyK. GrellaS. DreinerA. SchmidtW. HeiermannH. KappertH. VogtU. Paschen
- Multiple System Configurations in a 32-bit Extreme EnvironmentMichael C. Brown
- High-temperature Characterization of a 1200 V Power Module with 36 mm2 of SiC VJFET AreaKevin M. SpeerRobin SchraderDavid C. SheridanAndrew LemmonJim GaffordChris ParkerMichael S. MazzolaJeffrey B. Casady
Rodriguez, Rogie I., Dimeji Ibitayo, and Pedro Quintero. 2012. “Microstructural Evolution and Thermal Stability Characterization of a High Temperature Die Attach Lead-Free System.” IMAPSource Proceedings 2012 (HITEC): 1–11. https://doi.org/10.4071/HITEC-TA22.