ISSN 2380-4505
Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT
A Drop-in Die-Attach Solution for the High Temperature Lead-Free BiAgX Solder Paste System
A Drop-in Die-Attach Solution for the High Temperature Lead-Free BiAgX Solder Paste System
HongWen Zhang, Ning-Cheng Lee,
Zhang, HongWen, and Ning-Cheng Lee. 2012. “A Drop-in Die-Attach Solution for the High Temperature Lead-Free BiAgX Solder Paste System.” IMAPSource Proceedings 2012 (HITEC): 58–65. https://doi.org/10.4071/HITEC-2012-TA25.