ISSN 2380-4505
Vol. 2012, Issue HITEC, 2012January 01, 2012 EDT
A Drop-in Die-Attach Solution for the High Temperature Lead-Free BiAgX Solder Paste System
A Drop-in Die-Attach Solution for the High Temperature Lead-Free BiAgX Solder Paste System
HongWen Zhang, Ning-Cheng Lee,
Articles in Vol. 2012, Issue HITEC, 2012
Vol. 2012, Issue HITEC, 2012
- Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment ElectronicsM. MirgkizoudiC. LiuP. ConwayS. Riches
- Determination of the Creep Properties of Pb-free Solders for Harsh Environments Using Meso-scale TestingS. Godard DesmarestC. JohnstonP. S. Grant
- Investigation of Thick Film Technology for High Temperature ApplicationsZhangming ZhouJinzi CuiFang YuKun FangZhenzhen ShenR. Wayne JohnsonAlexey VertTan ZhangDavid Shaddock
- SOI-Based Integrated Gate Driver Circuit for High-Temperature ApplicationsR. L. GreenwellB.M. McCueM.I. LaurenceC.L. FandrichB.J. BlalockL.M. TolbertS.K. Islam
- SOI Based Voltage Regulator for High-Temperature ApplicationsB. M. McCueR. L. GreenwellM. I. LaurenceB. J. BlalockS. K. IslamL. M. Tolbert
- Pressureless Sintering Progression of a Silver Nanoparticle Attach Material Via Micrographic AnalysisManuel MolinaAndrés VelascoWilfredo OtañoPedro O. Quintero
- Development of Low RON,Diff, 12 kV, 4H-SiC GTOs For High-Power and High-Temperature ApplicationsLin ChengAnant K. AgarwalMichael OloughlinAl BurkCraig CapellKhiem LamJon ZhangJim RichmondJohn PalmourVictor TempleAderinto A. OgunniyiHeather K. O'BrienCharles J. Scozzie
- Silicon Carbide High Temperature Operational AmplifierAlexey VertCheng-Po ChenAmita PatilRich SaiaEmad AndarawisAvinash KashyapTan ZhangDave ShaddockZhenzhen ShenR. Wayne JohnsonRandy Normann
- Optimization of a Ceramic Circuit Board ClampDavid A. GlowkaRandy A. Normann
- Microstructural Evolution and Thermal Stability Characterization of a High Temperature Die Attach Lead-Free SystemRogie I. RodriguezDimeji IbitayoPedro Quintero
- High-Temperature Reliability of Direct-Bond-Copper Substrates with Sealed EdgesYiying YaoZheng ChenDushan BoroyevichKhai D. T. Ngo
- SILICON CARBIDE “SUPER” JUNCTION TRANSISTORS OPERATING AT 500 °CSiddarth SundaresanRanbir SinghR. Wayne Johnson
- Digital and Analogue Integrated Circuits in Silicon Carbide for High Temperature OperationE.P RamsayD.T. ClarkJ.D. CormackA.E. MurphyD.A SmithR.F. ThompsonR.A.R. YoungS. Finney
- SMD and Leaded Ceramic Capacitors for High Temperature ApplicationsAbhijit GuravXilin XuJim MageeJohn BultitudeTravis Ashburn
- SLID Bonding for Energy Dense Applications – Thermo-MechanicsAndreas LarssonTorleif André Tollefsen
- Communications System using a 1K22Monoconductor Cable for Down-hole Measurement ToolsRito MijarezDavid PascacioRicardo GuevaraJoaquín RodríguezOlimpia Pacheco
- Analog Component Development for 300°C Sensor Interface ApplicationsBruce W. OhmeMark R. Larson
- Silicon Capacitors with extremely high stability and reliability ideal for high temperature applicationsCatherine BunelLaurent Lengignon
- Electrical Performance of Co-Fired Alumina Substrates at High TemperaturesLiang-Yu Chen
- Highly Reliable Double-sided Bonding used in Double-sided Cooling for High Temperature Power ElectronicsSang Won YoonMichael D. GloverH. Alan MantoothKoji Shiozaki
- Extreme Thermal Transient Stress Analysis with Pre-Stress in a Metal Matrix Composite Power PackageDouglas C. HopkinsTheodore BaltisJames M PitaressDonald R. Hazelmyer
- Recent Progress in Thin Film Multichip Packaging for High Temperature Digital ElectronicsKun FangTami Isaacs-SmithR. Wayne JohnsonAlexey VertTan ZhangDavid Shaddock
- An Ultra-Low Noise Instrumentation Amplifer Designed for High Temperature ApplicationsJeff WatsonGustavo Castro
- Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength ReliabilitySatoshi TanimotoKohei MatsuiYusuke ZushiShinji SatoYoshinori MurakamiMasato TakamoriTakashi Iseki
- A High Current (>1500A) Power Module for High Temperature, High Performance Applications Using SiC TMOS Power SwitchesB. PassmoreJ. HornbergerB. McPhersonJ. BourneR. ShawE. CilioW. CilioB. ReeseT. McNuttM. SchupbachA.B. Lostetter
- High Temperature Ageing of Fe-based Nanocrystalline RibbonsChristian MartinRémi RobutelCyril ButtayFabien SixdenierPascal BevilacquaHervé MorelRégis Meuret
- DM300 - A 300°C Geothermal Directional Module DevelopmentD MacGugan
- Temperature Induced Voltage Offset Drifts in Silicon Carbide Pressure SensorsR.S. OkojieD. LukcoV. NguyenE. Savrun
- An Airborne High Temperature SiC Power Converter for Medium Power Smart Electro Mechanical ActuatorsDominique BergogneFabien DuboisChristian MartinKhalil El FalahiLuong Viet PhungCyril ButtaySonia DhokkarBruno AllardRégis MeuretHervé Morel
- High-Temperature Versatile Voltage-Mode PWM ControllerFabien LaplaceXavier MontmayeurJérôme ThomasGonzalo Picun
- Updated Analysis of Circuit Reliability Test ResultsMilton Watts
- A Drop-in Die-Attach Solution for the High Temperature Lead-Free BiAgX Solder Paste SystemHongWen ZhangNing-Cheng Lee
- Transient Liquid Phase Soldering for lead-free joining of power electronic modules in high temperature applicationsChristian EhrhardtMatthias HutterHermann OppermannKlaus-Dieter Lang
- Investigation of Photo-Imageable Thick Film Metallization on Low Temperature Cofired Ceramics (LTCC) for Improved Packaging DensityZhenzhen ShenR. Wayne JohnsonTan ZhangDavid Shaddock
- High temperature anti short circuit function for normally-on SiC JFET in an inverter leg configurationKhalil El FalahiLuong Viêt PhungBruno AllardDominique BergogneFabien Dubois
- Characterization and Reliability of custom digital ASIC designs using a 0.8μm bulk CMOS process for high temperature applicationsMark WattsShane Rose
- Reliability of electronics assembled using SAC + Zn solder pastesH.R. KotadiaA. PanneerselvamM.A. GreenM.P. ClodeS.H. MannanH. Steen
- High Temperature Performance of Coiled Glass CapacitorsEugene FurmanAmanda BakerSteve PeriniMohan MonoharanDouglas KushnerNanyan ZhangChen ZouCharles MiShihai ZhangTakashi MurataMichael Lanagan
- Characterization of the Vectron PX-570 Crystal Oscillator for Use in Harsh EnvironmentsJacob LiRichard L. PattersonAhmad Hammoud
- Nanocomposite Film Dielectrics for High Temperature Power Conditioning CapacitorsKirk SlenesLew Bragg
- Modeling of the Punch-Through Effect in Normally-On SiC JFET used in High Temperature Inverter for Aerospace ApplicationFabien DuboisHervé MorelDominique BergogneRégis Meuret
- Thermal Stress Reliability Study on Substrates for High Temperature, Silicon Carbide Power Electronic ModulesR. ShawP. DoyleJ. HornbergerA. LostetterB. McPhersonH. ProcellR. Schupbach
- A Design Paradigm to Facilitate Multiple Parts from a Single Silicon DesignRichard N. Rea
- Characterization and Reliability Testing on an LTCC Transformer Operable to 250 °CJames GalipeauGeorge Slama
- Characteristics of High Temperature Switch Mode Power SuppliesHarold L. Snyder
- Large-area Nanosilver Die-attach by Hot-pressing Below 200°C and 5 MPaKewei XiaoJesus N. CalataHanguang ZhengKhai D.T. NgoGuo-Quan Lu
- High Temperature Analog-to-Digital Converter Reliability TestingBruce W. OhmeMark R. Larson
- VEGA & RIGEL: New tiny high temperature adjustable voltage regulators for reduced PCB footprint and extended reliability of medium and high temperature systemsPierre DelatteEtienne VanzieleghemThomas FrançoisJean-Christophe Doucet
- Characterization of a Large Area Silicon Carbide PiN Diode at Temperatures up to 900°CJim RichmondLin ChengAnant AgarwalJohn Palmour
- High-Temperature, Bulk-CMOS Integrated Circuits for a Distributed Control System-Performance ResultsDan HoweSteve MajerusSteve GarverickWalter MerrillKen Semega
- High Power Lithium Primary Cells for High Temperature Downhole ApplicationsArden P. JohnsonJohn S. MillerYufei Wang
- A High Temp standalone 4MByte Flash memory with SPI Interface for 210C applicationsWade VonBergenMadhu Basude
- A Cyclic RSD Analog-Digital-Converter for Application Specific High Temperature Integrated Circuits up to 250°CAlexander SchmidtHolger KappertWolfgang HeiermannRainer Kokozinski
- End of Life Failure Modes for Packaged SOI Devices for Signal Conditioning and Processing ApplicationsS T RichesC JohnstonA CrossleyP Grant
- High Temperature Characterization up to 450 °C of MOSFETs and basic circuits realized in a Silicon-on-Insulator (SOI) CMOS-TechnologyK. GrellaS. DreinerA. SchmidtW. HeiermannH. KappertH. VogtU. Paschen
- Multiple System Configurations in a 32-bit Extreme EnvironmentMichael C. Brown
- High-temperature Characterization of a 1200 V Power Module with 36 mm2 of SiC VJFET AreaKevin M. SpeerRobin SchraderDavid C. SheridanAndrew LemmonJim GaffordChris ParkerMichael S. MazzolaJeffrey B. Casady
Zhang, HongWen, and Ning-Cheng Lee. 2012. “A Drop-in Die-Attach Solution for the High Temperature Lead-Free BiAgX Solder Paste System.” IMAPSource Proceedings 2012 (HITEC): 58–65. https://doi.org/10.4071/HITEC-2012-TA25.