ISSN 2380-4505
Vol. 2015, Issue HiTEN, 2015July 01, 2015 EDT
More than Drivers in Motor Drives: Closing the Loop
More than Drivers in Motor Drives: Closing the Loop
Gonzalo Picun, Khalil El-Falahi, Christophe Pautrel, Yoann Duse, Nicolas Joubert, Anaud Anotta, Georget Lemoyne, Simon Ribeyron, Olivier Guille, Gregory Thepaut, Fabien Laplace,
Articles in Vol. 2015, Issue HiTEN, 2015
Vol. 2015, Issue HiTEN, 2015
- Study of the electrical and thermal properties of a silicone elastomer filled with silica for high temperature power device encapsulationE. SiliM.L. LocatelliM. BecharaS. DiahamS. Dinculescu
- SiC Lateral Diodes for ESD Protection of High Temperature Integrated CircuitsReza GhandiCheng-Po (Paul) ChenAvinash S. KashyapEmad Andarawis
- Reliability of High Temperature LaminatesDavid ShaddockLiang Yin
- Solid Electrolytic Capacitors Designed for High Temperature ApplicationsRandy HahnKristin Tempel
- Inorganic Insulated Metal SubstratesPavel ShashkovSteven CurtisGiles Humpston
- High Temperature DC to DC converter operates in +215 °C environment, meeting demands of down-hole oil exploration marketAbhijit D. Pathak
- A High Temperature, High Power Density Package for SiC and GaN Power DevicesZ. ColeB. McGeeJ. StabachC. B. O'NealB. Passmore
- Silicon Carbide Functional Primitives for Wireless Sensor NodesA.B. HorsfallH.K. ChanK.V. VassilevskiN.G. WoodN.G. Wright
- Advances in Ceramic Capacitors for High Temperature ApplicationsAbhijit GuravXilin XuJim MageeReggie PhillipsTravis Ashburn
- Electromigration Phenomena in Sintered Nanoparticle Ag Systems Under High Current DensityAli MansourianSeyed Amir PaknejadQiannan WenKhalid KhtatbaAnatoly ZayatsSamjid H. Mannan
- Enabling Bulk Silicon CMOS Technology for Integration, Reliability, and Extended Lifetime at High TemperatureRex LowtherDavid GiffordWesley MorrisJim JensenScott PetersonKevin Atkinson
- Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450 °CA. KelbererS. DreinerK. GrellaD. DittrichH. KappertH. VogtU. Paschen
- Novel PCM-based coating for thermal management of high temperature electronic assembliesA. NovikovC. StrehseD. LexowM. Nowottnick
- More than Drivers in Motor Drives: Closing the LoopGonzalo PicunKhalil El-FalahiChristophe PautrelYoann DuseNicolas JoubertAnaud AnottaGeorget LemoyneSimon RibeyronOlivier GuilleGregory ThepautFabien Laplace
- High Temperature Dielectric Properties of Polyimide/Boron Nitride Nanocomposites: Nanoparticle Size and Filler Content EffectsF. SaysoukS. DiahamM.-L. Locatelli
- Bonding strength of Cu/Cu joints using micro-sized Ag particle paste for high-temperature applicationH. NishikawaX. LiuX. WangA. FujitaN. KamadaM. Saito
- Performance and Reliability of SiC dies, Die attach and Substrates for High Temperature Power Applications up to 300°CDean HamiltonLiam MillsSteve RichesPhilip Mawby
- Assessment of MEMS Vibration Energy Harvesting for High Temperature Sensing ApplicationsS T RichesK DoyleN TebbitY JiaA Seshia
- Semiconductor-to-metal attachment with silver-filled TPI bondlinesJim FraivilligRichard KobaKent Hutchings
- High Temperature Protection against Unwanted Species within Hermetic PackagingJennifer WilliamsJohnson Matthey
- Investigation of Automotive Power Semiconductor Module Operates at Elevated Cooling TemperatureYangang WangYibo WuXiaoping DaiSteve JonesGuoyou Liu
- Increased High-Temperature Reliability and Package Hardening of Commercial Integrated Circuits (Through Die Extraction, Electroless Nickel/Gold Pad Reconditioning, and Ceramic Re-Assembly)Erick M. Spory
- Factors influencing microstructural evolution in nanoparticle sintered Ag die attachS.A. PaknejadA. MansourianY. NohK. KhtatbaL. Van ParijsS.H. Mannan
- Optimized High Power GaN TransistorsJ. RobertsA. MizanL. Yushyna
- High-Temperature Component Evaluation of Commercial Flash Memory and Capacitors for Enhancement of Geothermal Tool DevelopmentAvery CashionGrzegorz Cieslewski
- The Design and Characterization of an 8-bit ADC for 250°C OperationLynn ReedJohn HoenigVema Reddy
- Test Results of Sintered Nano-Silver Paste Die Attach for High Temperature ApplicationsPaul CroteauSayan SealRyan WitherellMichael GloverShashank KrishnamurthyAlan Mantooth
- Simulation of a new hybrid Si/SiC power device for harsh environment applicationsP.M. GammonC.W. ChanP.A. Mawby
- High Temperature (225 °C) SiC – Based Wireless Power DemonstratorL.E. KegleyJ. GarrettS. MindenJ. Fraley
- Gate Stack Engineering for High Temperature Silicon Carbide CMOS ICsM.H. WengA.D. MurphyD.T. ClarkD.A. SmithR.F. ThompsonR.A.R. YoungE.P. RamsayH.K. ChanA.B. Horsfall
- “Turning ceramic on its head” – a polymer based packaging system for operation over 175°CPiers R. Tremlett
- A high temperature nano/micro vapor phase conformal coating for electronics applicationsRakesh Kumar
- Parametric Models of Ultrasonic Piezoelectric Transducers over a Wide Temperature RangeSteven A. MorrisJeremy Townsend
- A Low Power Data Acquisition Solution for High Temperature ApplicationsJeff WatsonMaithil Pachchigar
- Silver Thick Film Based Insulated Metal Substrates for High Temperature Power ApplicationsS T RichesJ WhitmarshD Hamilton
- High Temperature Anisotropic Magnetoresistive (AMR) SensorsBharat B. PantLucky WithanawasamMike BohlingerMark LarsonBruce W. Ohme
- High-Temperature Trench Capacitors, Using Thin-Film ALD DielectricsDorothee DietzYusuf CelikAndreas GoehlichHolger VogtHolger Kappert
- Investigation into the Role of Different Substrate Ni Compositions and Plating Methods on Die Attach ReliabilityJinzi CuiR. Wayne JohnsonMichael C. Hamilton
Picun, Gonzalo, Khalil El-Falahi, Christophe Pautrel, Yoann Duse, Nicolas Joubert, Anaud Anotta, Georget Lemoyne, et al. 2015. “More than Drivers in Motor Drives: Closing the Loop.” IMAPSource Proceedings 2015 (HiTEN): 179–88. https://doi.org/10.4071/HiTEN-Session5-Paper5_3.