ISSN 2380-4505
Vol. 2015, Issue HiTEN, 2015July 01, 2015 EDT
Semiconductor-to-metal attachment with silver-filled TPI bondlines
Semiconductor-to-metal attachment with silver-filled TPI bondlines
Jim Fraivillig, Richard Koba, Kent Hutchings,
Fraivillig, Jim, Richard Koba, and Kent Hutchings. 2015. “Semiconductor-to-Metal Attachment with Silver-Filled TPI Bondlines.” IMAPSource Proceedings 2015 (HiTEN): 64–67. https://doi.org/10.4071/HiTEN-Session2-Paper2_4.