ISSN 2380-4505
Vol. 2015, Issue HiTEN, 2015July 01, 2015 EDT
High Temperature DC to DC converter operates in +215 °C environment, meeting demands of down-hole oil exploration market
High Temperature DC to DC converter operates in +215 °C environment, meeting demands of down-hole oil exploration market
Abhijit D. Pathak,
Articles in Vol. 2015, Issue HiTEN, 2015
Vol. 2015, Issue HiTEN, 2015
- Study of the electrical and thermal properties of a silicone elastomer filled with silica for high temperature power device encapsulationE. SiliM.L. LocatelliM. BecharaS. DiahamS. Dinculescu
- SiC Lateral Diodes for ESD Protection of High Temperature Integrated CircuitsReza GhandiCheng-Po (Paul) ChenAvinash S. KashyapEmad Andarawis
- Reliability of High Temperature LaminatesDavid ShaddockLiang Yin
- Solid Electrolytic Capacitors Designed for High Temperature ApplicationsRandy HahnKristin Tempel
- Inorganic Insulated Metal SubstratesPavel ShashkovSteven CurtisGiles Humpston
- High Temperature DC to DC converter operates in +215 °C environment, meeting demands of down-hole oil exploration marketAbhijit D. Pathak
- A High Temperature, High Power Density Package for SiC and GaN Power DevicesZ. ColeB. McGeeJ. StabachC. B. O'NealB. Passmore
- Silicon Carbide Functional Primitives for Wireless Sensor NodesA.B. HorsfallH.K. ChanK.V. VassilevskiN.G. WoodN.G. Wright
- Advances in Ceramic Capacitors for High Temperature ApplicationsAbhijit GuravXilin XuJim MageeReggie PhillipsTravis Ashburn
- Electromigration Phenomena in Sintered Nanoparticle Ag Systems Under High Current DensityAli MansourianSeyed Amir PaknejadQiannan WenKhalid KhtatbaAnatoly ZayatsSamjid H. Mannan
- Enabling Bulk Silicon CMOS Technology for Integration, Reliability, and Extended Lifetime at High TemperatureRex LowtherDavid GiffordWesley MorrisJim JensenScott PetersonKevin Atkinson
- Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450 °CA. KelbererS. DreinerK. GrellaD. DittrichH. KappertH. VogtU. Paschen
- Novel PCM-based coating for thermal management of high temperature electronic assembliesA. NovikovC. StrehseD. LexowM. Nowottnick
- More than Drivers in Motor Drives: Closing the LoopGonzalo PicunKhalil El-FalahiChristophe PautrelYoann DuseNicolas JoubertAnaud AnottaGeorget LemoyneSimon RibeyronOlivier GuilleGregory ThepautFabien Laplace
- High Temperature Dielectric Properties of Polyimide/Boron Nitride Nanocomposites: Nanoparticle Size and Filler Content EffectsF. SaysoukS. DiahamM.-L. Locatelli
- Bonding strength of Cu/Cu joints using micro-sized Ag particle paste for high-temperature applicationH. NishikawaX. LiuX. WangA. FujitaN. KamadaM. Saito
- Performance and Reliability of SiC dies, Die attach and Substrates for High Temperature Power Applications up to 300°CDean HamiltonLiam MillsSteve RichesPhilip Mawby
- Assessment of MEMS Vibration Energy Harvesting for High Temperature Sensing ApplicationsS T RichesK DoyleN TebbitY JiaA Seshia
- Semiconductor-to-metal attachment with silver-filled TPI bondlinesJim FraivilligRichard KobaKent Hutchings
- High Temperature Protection against Unwanted Species within Hermetic PackagingJennifer WilliamsJohnson Matthey
- Investigation of Automotive Power Semiconductor Module Operates at Elevated Cooling TemperatureYangang WangYibo WuXiaoping DaiSteve JonesGuoyou Liu
- Increased High-Temperature Reliability and Package Hardening of Commercial Integrated Circuits (Through Die Extraction, Electroless Nickel/Gold Pad Reconditioning, and Ceramic Re-Assembly)Erick M. Spory
- Factors influencing microstructural evolution in nanoparticle sintered Ag die attachS.A. PaknejadA. MansourianY. NohK. KhtatbaL. Van ParijsS.H. Mannan
- Optimized High Power GaN TransistorsJ. RobertsA. MizanL. Yushyna
- High-Temperature Component Evaluation of Commercial Flash Memory and Capacitors for Enhancement of Geothermal Tool DevelopmentAvery CashionGrzegorz Cieslewski
- The Design and Characterization of an 8-bit ADC for 250°C OperationLynn ReedJohn HoenigVema Reddy
- Test Results of Sintered Nano-Silver Paste Die Attach for High Temperature ApplicationsPaul CroteauSayan SealRyan WitherellMichael GloverShashank KrishnamurthyAlan Mantooth
- Simulation of a new hybrid Si/SiC power device for harsh environment applicationsP.M. GammonC.W. ChanP.A. Mawby
- High Temperature (225 °C) SiC – Based Wireless Power DemonstratorL.E. KegleyJ. GarrettS. MindenJ. Fraley
- Gate Stack Engineering for High Temperature Silicon Carbide CMOS ICsM.H. WengA.D. MurphyD.T. ClarkD.A. SmithR.F. ThompsonR.A.R. YoungE.P. RamsayH.K. ChanA.B. Horsfall
- “Turning ceramic on its head” – a polymer based packaging system for operation over 175°CPiers R. Tremlett
- A high temperature nano/micro vapor phase conformal coating for electronics applicationsRakesh Kumar
- Parametric Models of Ultrasonic Piezoelectric Transducers over a Wide Temperature RangeSteven A. MorrisJeremy Townsend
- A Low Power Data Acquisition Solution for High Temperature ApplicationsJeff WatsonMaithil Pachchigar
- Silver Thick Film Based Insulated Metal Substrates for High Temperature Power ApplicationsS T RichesJ WhitmarshD Hamilton
- High Temperature Anisotropic Magnetoresistive (AMR) SensorsBharat B. PantLucky WithanawasamMike BohlingerMark LarsonBruce W. Ohme
- High-Temperature Trench Capacitors, Using Thin-Film ALD DielectricsDorothee DietzYusuf CelikAndreas GoehlichHolger VogtHolger Kappert
- Investigation into the Role of Different Substrate Ni Compositions and Plating Methods on Die Attach ReliabilityJinzi CuiR. Wayne JohnsonMichael C. Hamilton
Pathak, Abhijit D. 2015. “High Temperature DC to DC Converter Operates in +215 °C Environment, Meeting Demands of down-Hole Oil Exploration Market.” IMAPSource Proceedings 2015 (HiTEN): 161–78. https://doi.org/10.4071/HiTEN-Session5-Paper5_2.