ISSN 2380-4505
Articles in Vol. 2015, Issue S1, 2015
Vol. 2015, Issue S1, 2015
- Microelectronics/Packagingin the Defense Industry:Importance of SWaP-Cand Other FactorsLee Wiewiora
- Future Challenges and Roadmaps of Semiconductor, Packaging and IntegrationBerthold Hellenthal
- Sensor Integration Technologies for Internet of ThingsFranz Schrank
- Maintaining The Pace of Progress As We Approach The End Of Moore's Law: New Materials, New Processes, New ArchitecturesBill Bottoms
Schrank, Franz. 2015. “Sensor Integration Technologies for Internet of Things.” IMAPSource Proceedings 2015 (S1): S1–34. https://doi.org/10.4071/isom-2015-slide-3.