ISSN 2380-4505
Vol. 2015, Issue S1, 2015October 01, 2015 EDT
Future Challenges and Roadmaps of Semiconductor, Packaging and Integration
Future Challenges and Roadmaps of Semiconductor, Packaging and Integration
Articles in Vol. 2015, Issue S1, 2015
Vol. 2015, Issue S1, 2015
- Microelectronics/Packagingin the Defense Industry:Importance of SWaP-Cand Other FactorsLee Wiewiora
- Future Challenges and Roadmaps of Semiconductor, Packaging and IntegrationBerthold Hellenthal
- Sensor Integration Technologies for Internet of ThingsFranz Schrank
- Maintaining The Pace of Progress As We Approach The End Of Moore's Law: New Materials, New Processes, New ArchitecturesBill Bottoms
Hellenthal, Berthold. 2015. “Future Challenges and Roadmaps of Semiconductor, Packaging and Integration.” IMAPSource Proceedings 2015 (S1): S1–37. https://doi.org/10.4071/isom-2015-slide-2.