ISSN 2380-4505
Vol. 2015, Issue S1, 2015October 01, 2015 EDT
Microelectronics/Packagingin the Defense Industry:Importance of SWaP-Cand Other Factors
Microelectronics/Packagingin the Defense Industry:Importance of SWaP-Cand Other Factors
Articles in Vol. 2015, Issue S1, 2015
Vol. 2015, Issue S1, 2015
- Microelectronics/Packagingin the Defense Industry:Importance of SWaP-Cand Other FactorsLee Wiewiora
- Future Challenges and Roadmaps of Semiconductor, Packaging and IntegrationBerthold Hellenthal
- Sensor Integration Technologies for Internet of ThingsFranz Schrank
- Maintaining The Pace of Progress As We Approach The End Of Moore's Law: New Materials, New Processes, New ArchitecturesBill Bottoms
Wiewiora, Lee. 2015. “Microelectronics/Packagingin the Defense Industry:Importance of SWaP-Cand Other Factors.” IMAPSource Proceedings 2015 (S1): S1–11. https://doi.org/10.4071/isom-2015-slide-1.