ISSN 2380-4505
Articles in Vol. 2024, Issue HiTEN, 2024
Vol. 2024, Issue HiTEN, 2024
- Additively Manufactured High Temperature Passive RF ComponentsDavid ShaddockCathleen HoelJared HaleMark PoliksFiras AlshatnawiEmuobosan EnakerakpoAshraf UmarMohamed Abdelatty
- Investigation of Ohmic Contacts and Resistances of a 4H-SiC CMOS Technology up to 550°CMathias RommelAlexander MayLeander BaierJulian KauthNorman BöttcherMichael Jank
- Device Variability Compensation in High Temperature Electronics for Hall Sensing ApplicationsJacob KayMax WatsonAndrew GallantAlton Horsfall
- 300 Degree Celsius Electronic Component PackagingAndrew WrightManuel Montano
- Ceramic Sensor Elements for Geothermal ApplicationsSteffen ZiescheAdrian GoldbergBirgit ManhicaHolger KappertMartin Jägle
- Identification to Future Research for High Temperature Instrumentation for Geothermal ApplicationsAndrew Wright
Wright, Andrew, and Manuel Montano. 2026. “300 Degree Celsius Electronic Component Packaging.” IMAPSource Proceedings 2024 (HiTEN): 27–31. https://doi.org/10.4071/001c.155881.