ISSN 2380-4505
Vol. 2024, Issue HiTEN, 2024January 27, 2026 EDT
Additively Manufactured High Temperature Passive RF Components
Additively Manufactured High Temperature Passive RF Components
Articles in Vol. 2024, Issue HiTEN, 2024
Vol. 2024, Issue HiTEN, 2024
- Additively Manufactured High Temperature Passive RF ComponentsDavid ShaddockCathleen HoelJared HaleMark PoliksFiras AlshatnawiEmuobosan EnakerakpoAshraf UmarMohamed Abdelatty
- Investigation of Ohmic Contacts and Resistances of a 4H-SiC CMOS Technology up to 550°CMathias RommelAlexander MayLeander BaierJulian KauthNorman BöttcherMichael Jank
- Device Variability Compensation in High Temperature Electronics for Hall Sensing ApplicationsJacob KayMax WatsonAndrew GallantAlton Horsfall
- 300 Degree Celsius Electronic Component PackagingAndrew WrightManuel Montano
- Ceramic Sensor Elements for Geothermal ApplicationsSteffen ZiescheAdrian GoldbergBirgit ManhicaHolger KappertMartin Jägle
- Identification to Future Research for High Temperature Instrumentation for Geothermal ApplicationsAndrew Wright
Shaddock, David, Cathleen Hoel, Jared Hale, Mark Poliks, Firas Alshatnawi, Emuobosan Enakerakpo, Ashraf Umar, and Mohamed Abdelatty. 2026. “Additively Manufactured High Temperature Passive RF Components.” IMAPSource Proceedings 2024 (HiTEN): 1–12. https://doi.org/10.4071/001c.155877.