ISSN 2380-4505
Vol. 2016, Issue NOR, 2016July 01, 2016 EDT
Use of Soldered or Glued PCSB as Interconnection between PCB and Ceramic Package in Harsh Environment
Use of Soldered or Glued PCSB as Interconnection between PCB and Ceramic Package in Harsh Environment
Jakob Gakkestad, Ottar Opland, Per Dalsjø, Susanne Helland, Helge Kristiansen, Maaike M. Visser Taklo, Daniel N. Wright,
Articles in Vol. 2016, Issue NOR, 2016
Vol. 2016, Issue NOR, 2016
- Measurements of Acoustic Material Properties Using Ultrasonic Through Transmission TechniqueHoa T. K. TranTung ManhLars Hoff
- Use of Soldered or Glued PCSB as Interconnection between PCB and Ceramic Package in Harsh EnvironmentJakob GakkestadOttar OplandPer DalsjøSusanne HellandHelge KristiansenMaaike M. Visser TakloDaniel N. Wright
- Reliability of Passive UHF RFID Copper Tags on Plywood Substrate in High Humidity ConditionsErja SipiläJohanna VirkkiLauri SydänheimoLeena Ukkonen
Gakkestad, Jakob, Ottar Opland, Per Dalsjø, Susanne Helland, Helge Kristiansen, Maaike M. Visser Taklo, and Daniel N. Wright. 2016. “Use of Soldered or Glued PCSB as Interconnection between PCB and Ceramic Package in Harsh Environment.” IMAPSource Proceedings 2016 (NOR): 1–6. https://doi.org/10.4071/2016-NOR-Gakkestad.