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Use of Soldered or Glued PCSB as Interconnection between PCB and Ceramic Package in Harsh Environment

Jakob Gakkestad, Ottar Opland, Per Dalsjø, Susanne Helland, Helge Kristiansen, Maaike M. Visser Taklo, Daniel N. Wright,
• https://doi.org/10.4071/2016-NOR-Gakkestad
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