ISSN 2380-4505
Vol. 2019, Issue NOR, 2019June 01, 2019 EDT
Scalability of Copper-Interconnects down to 3μm on Printed Boards by Laser-assisted-subtractive process
Scalability of Copper-Interconnects down to 3μm on Printed Boards by Laser-assisted-subtractive process
Sarthak Acharya, Shailesh Singh Chouhan, Jerker Delsing,
Articles in Vol. 2019, Issue NOR, 2019
Vol. 2019, Issue NOR, 2019
- Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS mirrorHenri AilasJaakko SaarilahtiTuomas PensalaJyrki Kiihamäki
- Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat SpreaderYa LiuNan WangLilei YeAbdelhafid ZehriAndreas NylanderAmos NkansahHongbin LuJohan Liu
- Scalability of Copper-Interconnects down to 3μm on Printed Boards by Laser-assisted-subtractive processSarthak AcharyaShailesh Singh ChouhanJerker Delsing
- Implementation of Flexible Displays for Smart Textiles Using Processes of Printed ElectronicsArtem Ivanov
- A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronicsN PalavesamW HellA DrostC LandesbergerC KutterK Bock
Acharya, Sarthak, Shailesh Singh Chouhan, and Jerker Delsing. 2019. “Scalability of Copper-Interconnects down to 3μm on Printed Boards by Laser-Assisted-Subtractive Process.” IMAPSource Proceedings 2019 (NOR): 17–20. https://doi.org/10.4071/2380-4491-2019-NOR-Acharya.