ISSN 2380-4505
Vol. 2019, Issue NOR, 2019June 01, 2019 EDT
Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS mirror
Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS mirror
Henri Ailas, Jaakko Saarilahti, Tuomas Pensala, Jyrki Kiihamäki,
Articles in Vol. 2019, Issue NOR, 2019
Vol. 2019, Issue NOR, 2019
- Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS mirrorHenri AilasJaakko SaarilahtiTuomas PensalaJyrki Kiihamäki
- Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat SpreaderYa LiuNan WangLilei YeAbdelhafid ZehriAndreas NylanderAmos NkansahHongbin LuJohan Liu
- Scalability of Copper-Interconnects down to 3μm on Printed Boards by Laser-assisted-subtractive processSarthak AcharyaShailesh Singh ChouhanJerker Delsing
- Implementation of Flexible Displays for Smart Textiles Using Processes of Printed ElectronicsArtem Ivanov
- A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronicsN PalavesamW HellA DrostC LandesbergerC KutterK Bock
Ailas, Henri, Jaakko Saarilahti, Tuomas Pensala, and Jyrki Kiihamäki. 2019. “Low-Temperature Cu-Cu Thermocompression Bonding for Encapsulation of a MEMS Mirror.” IMAPSource Proceedings 2019 (NOR): 12–16. https://doi.org/10.4071/2380-4491-2019-NOR-Ailas.