ISSN 2380-4505
Vol. 2016, Issue S1, 2016October 01, 2016 EDT
Lift up! to IC Packaging: Trends and Assembly Reliability
Lift up! to IC Packaging: Trends and Assembly Reliability
Articles in Vol. 2016, Issue S1, 2016
Vol. 2016, Issue S1, 2016
- Lift up! to IC Packaging: Trends and Assembly ReliabilityReza Ghaffarian
- Strategy and Ecosystem for Microelectronics Assembly in the United StatesJonathon Greenwood
- Creating Semiconductor Value through Advanced Package TechnologyRon Huemoeller
Ghaffarian, Reza. 2016. “Lift up! To IC Packaging: Trends and Assembly Reliability.” IMAPSource Proceedings 2016 (S1): S1–28. https://doi.org/10.4071/isom-2016-slide-3.