ISSN 2380-4505
Vol. 2016, Issue S1, 2016October 01, 2016 EDT
Creating Semiconductor Value through Advanced Package Technology
Creating Semiconductor Value through Advanced Package Technology
Articles in Vol. 2016, Issue S1, 2016
Vol. 2016, Issue S1, 2016
- Lift up! to IC Packaging: Trends and Assembly ReliabilityReza Ghaffarian
- Strategy and Ecosystem for Microelectronics Assembly in the United StatesJonathon Greenwood
- Creating Semiconductor Value through Advanced Package TechnologyRon Huemoeller
Huemoeller, Ron. 2016. “Creating Semiconductor Value through Advanced Package Technology.” IMAPSource Proceedings 2016 (S1): S1–46. https://doi.org/10.4071/isom-2016-slide-1.