ISSN 2380-4505
Vol. 2016, Issue S2, 2016October 01, 2016 EDT
Experimental Study on 28nm Chip/Package Interactions in eWLB (Embedded Wafer Level BGA) Fan-Out Wafer Level Packages
Experimental Study on 28nm Chip/Package Interactions in eWLB (Embedded Wafer Level BGA) Fan-Out Wafer Level Packages
Articles in Vol. 2016, Issue S2, 2016
Vol. 2016, Issue S2, 2016
- On the Way from Fan-out Wafer to Fan-out Panel Level PackagingKarl-Friedrich BeckerTanja BraunS. RaatzM. MinkusV. BaderJ. BauerR. AschenbrennerR. KahleL. GeorgiS. VogesM. WöhrmannK.-D. Lang
- FO-WLP: A Disruptive TechnologyJan Vardaman
- Experimental Study on 28nm Chip/Package Interactions in eWLB (Embedded Wafer Level BGA) Fan-Out Wafer Level PackagesDongkai ShangguanYao Jian LinWon Kyung ChoiSeng Guan ChowSeung Wook Yoon
- FOWLP Technology eWLB - Enabler for Packaging of IoT/IoE ModulesSteffen Kroenhert
- Chip Package Interaction Considerations in Fan-out Wafer Level PackagingUrmi Ray
- Assessment of Optimized Process Quality and Reliability for Wafer Level ApplicationsEnnis OgawaAimin XingDavid F.-S. LiaoTen V. Y. TenChong Wei NeoFeynman W.-C. ChiangGaius SeeMabrouk ChaaraGeorge HungEndruw JahjaSteven NguyenMichael HsiehRicky W. M. ChenDarren M.-L. HoSusan R. MulfordHugh Jorge-EstevezMelissa LauLeah HilbornKashish ShahRichard MahJeff MendozaBei ZhuGalen KirkpatrickYing-Ying HsiehPaolo SamsonJames S. J. TongLiming TsauJ.K. WangVijay ReddyFrank HuiJaved SandhuManoj NairKeith TanEdward Law
Shangguan, Dongkai, Yao Jian Lin, Won Kyung Choi, Seng Guan Chow, and Seung Wook Yoon. 2016. “Experimental Study on 28nm Chip/Package Interactions in eWLB (Embedded Wafer Level BGA) Fan-Out Wafer Level Packages.” IMAPSource Proceedings 2016 (S2): S1–22. https://doi.org/10.4071/isom-2016-slide-9.