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Symposium Proceedings
Vol. 2011, Issue 1, 2011
January 01, 2011 EDT
Evaluation of Test Protocol for Eutectic Die Attach Using High Power LEDs
Amanda Hartnett
,
Seth Homer
,
Donald Beck
,
Daniel Evans
,
Gold-Tin Solder
LED
Die Bonder
Preform
Paste
Automated Pick-and-Place
Eutectic Die Attach
Solder Spread
•
https://doi.org/10.4071/isom-2011-TA4-Paper4
IMAPSource Conference Papers
Hartnett, Amanda, Seth Homer, Donald Beck, and Daniel Evans. 2011. “Evaluation of Test Protocol for Eutectic Die Attach Using High Power LEDs.”
IMAPSource Proceedings
2011 (1): 136–41.
https://doi.org/10.4071/isom-2011-TA4-Paper4
.
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