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Symposium Proceedings
Vol. 2011, Issue 1, 2011January 01, 2011 EDT

Evaluation of Test Protocol for Eutectic Die Attach Using High Power LEDs

Amanda Hartnett, Seth Homer, Donald Beck, Daniel Evans,
Gold-Tin Solder LED Die Bonder Preform Paste Automated Pick-and-Place Eutectic Die Attach Solder Spread
• https://doi.org/10.4071/isom-2011-TA4-Paper4
IMAPSource Conference Papers
Hartnett, Amanda, Seth Homer, Donald Beck, and Daniel Evans. 2011. “Evaluation of Test Protocol for Eutectic Die Attach Using High Power LEDs.” IMAPSource Proceedings 2011 (1): 136–41. https://doi.org/10.4071/isom-2011-TA4-Paper4.
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