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Evaluation of Test Protoc...
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Evaluation of Test Protocol for Eutectic Die Attach Using High Power LEDs
Amanda Hartnett
,
Seth Homer
,
Donald Beck
,
Daniel Evans
,
Gold-Tin Solder
LED
Die Bonder
Preform
Paste
Automated Pick-and-Place
Eutectic Die Attach
Solder Spread
• https://doi.org/10.4071/isom-2011-TA4-Paper4
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