ISSN 2380-4505
Vol. 2026, Issue Symposium, 2026November 02, 2026 EDT
Advanced Two-Step Filling Approach for High-Aspect-Ratio TGV Structures
Advanced Two-Step Filling Approach for High-Aspect-Ratio TGV Structures
Dennis Fiedler, Grigory Vazhenin, Hee-Bum Shin, Tobias Sponholz, Tatjana Königsmann, Dirk Rohde, Stefanie Ackermann,
Articles in Vol. 2026, Issue Symposium, 2026
Vol. 2026, Issue Symposium, 2026
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- Thin Glass Substrates with TGV: Handling and Process AdvancesJoshua RoysDavid LevyKyle LiddleNick StucchiSabina KanjicPatrick BorrelliBrian Harding
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- Reliability Benchmarking Novel Ag-sinter Die-Attach Against High-Pb Solder Under Thermal Cycling and High-Temperature Storage TestingHenry A. MartinB. Senthil KumarFrans G. M. MeeuwsenEdsger C. P. SmitsRuud D. Wit
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Fiedler, Dennis, Grigory Vazhenin, Hee-Bum Shin, Tobias Sponholz, Tatjana Königsmann, Dirk Rohde, and Stefanie Ackermann. 2026. “Advanced Two-Step Filling Approach for High-Aspect-Ratio TGV Structures.” IMAPSource Proceedings 2026 (Symposium): 340–45. https://doi.org/10.4071/001c.173491.