ISSN 2380-4505
Vol. 2026, Issue Symposium, 2026October 27, 2026 EDT
Interaction of Laser Assisted Soldering Versus Standard Mass Reflow on FCBGA Assembly Process and Board Level Reliability
Interaction of Laser Assisted Soldering Versus Standard Mass Reflow on FCBGA Assembly Process and Board Level Reliability
Articles in Vol. 2026, Issue Symposium, 2026
Vol. 2026, Issue Symposium, 2026
- Comprehensive Study of Innovative embedded Capacitor Block (eCB) in The Package Core Layer for The Improvement of Power Delivery Network DesignsKuan ChenSugawara YusukeMasaharu YasudaHiroaki HoriAtsuo Kawagoe
- Advanced Embedding Technologies for High Performance SiC Power Modules in Automotive ApplicationsLars BöttcherDavid SchützeThomas LöherManuel SeckelAndreas Ostmann
- Additive Manufacturing Methods for Embedded ResistorsGregory TigheJohn BennettGuinevere StrackAlkim AkyurtluAndrea BoeroVeraMahsa GhandiJasmina Burek
- The Substrate is the PCB: A Packaging Architecture for Vertical Power Delivery in Multi-Kilowatt AI ProcessorsFrancesco Carobolante
- Chip-to-Wafer Hybrid Bonding using Polyimide Dielectric for Low-Temperature Process with High Yield and ReliabilityYugo TanigakiKota NomuraXie LingMishra DileepMasaya JukeiKai IshigamiTakenori FujiwaraVasarla Nagendra SekharYu ShojiTomoyuki HondaHitoshi Araki
- Characterizing the Impact of In-Plane Deformation in Die-to-Wafer Hybrid Bonding from Die Warpage and Bonder Shape EffectsChongyang CaiLiu JiangEl Mehdi Bazizi
- Enabling Low-Temperature Cu-to-Cu Direct Bonding via Nanocrystalline Cu and Cu-Selective Oxide Suppression CoatingOliver M.R. ChyanKevin Antony Jesu DuraiKhanh Tuyet Anh TranDuwage Anushka Sandaruwan PereraShinoj Sridharan Nair
- Sustainable Ambient-Air Cu-Cu Wedge Bonding via Cu-Selective Ultrathin PassivationOliver ChyanShyam Muralidharan NairDuwage Anushka Sandaruwan PereraWonbong Choi
- Superior Reliability of Copper Ball Bonds with Compatible EMCSarangapani MuraliDhayalan MariyappanTan Tze QingLim Yee (Evonne) WeonYee Boon HwaNg Kim MengWei Kok
- Non – Traditional Structures for RF Component Footprint CompactionNathaniel D’AgatiAlkim Akyurtlu
- Interfacial Characterization of Fine-Pitch Cu/Polyimide L/S Structures for RDL Improvement Using AFM-IR and TEM-EELSMasahiro SaitoHirofumi SekiTatsuhiro NagasakaNaohiko KawasakiAi HashimotoHideki HashimotoChin-Hung WangWei-Chung Lo
- Identification and Qualification of a Replacement for Discontinued Underfill Material for High-Reliability Flip-Chip AssembliesGhassan Abu-hamdehKevin CoxJosiah MakinsterCarter Webber
- Advancing Panel-Level Fan-Out Technologies for High-Frequency and Power Devices through Alternative Through-Package InterconnectsTindara VerduciArjun WadhwaRuud de Wit
- Pioneering Bottom-Up Copper Plating: Advanced Pillar-Like Metallization for High Aspect Ratio Through Glass ViasSean FleurielKen CrouseInosh PereraSaminda DharmarathnaScott BrossmanDiana Aranzales
- The Effect of Ni Content in Electroless Cu Deposit on the Adhesion Between the Seed Layer and Glass SubstrateKanji MatsumotoTomoharu NakayamaShinichiro YoshidaHisamitsu Yamamoto
- Enhanced Adhesion of Electroplated Ti/Cu Films on Glass by CF₄ Plasma Treatment and Annealing in Glass Core PCB TechnologyMei-Yun YehChih-Kai ChanHsuan-Chung ChanChia-Hao ChangShih-Lian ChengHsiao-Ping HsuC. W. Lan
- Enabling High-Density Power Packaging: Bridge and Fill for Through-Hole Filling in Advanced IC Substrate CoreInosh PereraScott BrossmanDiana AranzalesSaminda Dharmarathna
- Mechanical Reliability Estimation for FCCSP Platform DevicesAlex LampertYutaka SuzukiJaimal WilliamsonTom KronenbergDeepa KoteFrancis OyebanjoMadison MonzingoKarthekeyan SridharSylvester Ankamah-KusiBlake TravisGregory OstrowickiRajen MuruganUsman Chaudhry
- From Reflow to Fatigue: A Continuum Damage Mechanics Framework Incorporating Individualized As-Reflowed Solder GeometryHenan MaoJunyan HeLinqi ZhuangAdarsh Chaurasia
- A Generic Incompressible Smoothed Particle Galerkin Framework for Modeling and Optimization of Thermal Interface Material and Adhesive SpreadingHenan MaoJunyan HeSameer JapeYi ZhangXiaofei Pan
- Towards a Digital Twin for Failure Risk Prediction of Epoxy Mold Compounds and Warpage Modeling in Advanced PackagingSasi Kumar TippabhotlaJi LinTai-Chong Chai
- High Density Interconnect Scaling Beyond Organic Substrates Using Glass CoresLars BöttcherRuben KahleAndreas Ostmann
- Microfluidic Cooling Integrated into Glass SubstratesMatt HeidelJeb FlemmingKyle McWethyNathan LivingstonJeff Bullington
- Warpage Control Strategies in 3D Advanced Packaging: A Focus on Post-Processing and Material-Level OptimizationEunah KoOhguk KwonYuna KimHuiyeong JangJongyong KimChaemin ImDougkuk LeeSun Jae KimYonghoe ChoMoonsoo LeeTaehwi KimChajea Jo
- Interaction of Laser Assisted Soldering Versus Standard Mass Reflow on FCBGA Assembly Process and Board Level ReliabilityJaimal WilliamsonAlex LampertYutaka SuzukiUsman Chaudhry
- A Combined Atmospheric Argon Plasma and In-Situ Formic Acid Vapor Fluxless TCB Process for Advanced PackagingAdeel BajwaAnton TurpaultFrank WangTom ColosimoPeter Van EmmerickBob Chylak
- Reliability Advantages of Innolot® Lead‑Free Solder over SAC305 on Fine Pitch InterconnectsB. Senthil KumarS. MuraliZhang Rui FenAgala JoelTan Tze QingZhang HanWen
- Cylindrically Mounted MEMS Chips Enable Planar and Annular Ultrasonic Modulation of a CatheterGerd KropkeDaniel LieskeIngolf Schlosser
- Moisture Control in High Reliability Devices: Correlation of Internal Vapor Analysis and Water Sorption Isotherms for Getter Design OptimizationAlessio CorazzaLuca MauriGiovanni ZafaranaGiulia LezzaniFederico Gallino
- Reliability of Copper Electrodes on Glass Substrates Fabricated by the TORIZING Process for TGV ApplicationsMing-chun HsiehMasahiko NishijimaAiji SuetakeTakuya NakagiriSangmin LeeKimihiro YamanakaRieko OkumuraYuhei KitaharaJunichi YoshikawaHiroshi NishikawaKatsuaki Suganuma
- Domestic Build-Up Film Advancing Fan-Out Wafer-Level Packaging (FOWLP) Through the SHIELD USA ProgramNazeef AzamTanya Singh-RachfordJohn CoonrodScott KennedyBenjamin LeveilleScott DerosierBryan TworzydloGeorgios C. DogiamisMatthew Magnavita
- Low‑Shrinkage Photosensitive Polyimide for CMP-free Multilayer RDL Fabrication ProcessT. KambaraD. MatsukawaT. OkudaS. FukuzumiS. KawashitaY. ImazuT. Minegishi
- High‑Thermal-Conductivity (1.8 W/(m·K)) Dry‑Film Solder Resist at 20 μm Thickness: Compatible with Standard Process Flow and Steady‑State Thermal ValidationTakumi SuzukiKohei KitagawaRyohei NojimaFumitaka KatoDaichi Okamoto
- Multifunctional Silicone Hotmelt Materials Integrating Stress Relaxation and Thermal Management for Advanced ElectronicRyosuke YamazakiHsiang Chuan ChenJoseph R. SootsmanXi YangKatsuhiro AkiyamaEun Ko
- Single Bath Copper Electroplating for Seam Free Metallization of Ultra High Aspect Ratio (AR ≤ 34) Through Glass ViasPei Lien TsengYiu-Hsiang ChangKuan-Ting KuoKanungo MandakiniPrantik MazumderScott C. Pollard
- Process Window Design Framework for Packaging Materials Using Physics-Informed Property Prediction ModelsKaede AmeyamaMoeko YanagisawaKohei MotojimaHayato SugiyamaYoshihiko MuraiChiho Ueta
- Digital Twin–Ready Underfill Simulation with High-Speed CFDAlan LewisZubin TrivediLeonid BraunErik FiskeJames Crist
- Cost Analysis of 310x310mm Panels for High-Performance Computing Driven by Artificial IntelligenceAmy LujanJohn Lau
- Board-Level Electronics Reliability Analysis Using Delphi thermal Networks and Superelements in Ansys MechanicalJunyan HeEric Monier-VinardAdarsh Chaurasia
- Material Solutions for AI/HPC Packaging from Wafer Bumping to System AssemblySheng Hung ChouSze Pei LimChun Wei Yang
- Plasma Dicing Innovations on Film Frame Carriers for High-Bandwidth Memory (HBM) and Heterogeneous Integration DevicesSimon DawsonJanet HopkinsRichard BarnettTejinder SinghKsenija VargaMatthias BrunnbauerAlois MalzerTobias Zenger
- High-Temperature Resistant Laser-Release Material for Advanced Packaging Temporary Bonding/Debonding ApplicationsXin LiArthur SouthardBrandon NeilDongshun Bai
- Advanced Spray-Deposited MOD Silver Backside Metallization for Metal TIM Integration in Heterogeneous Semiconductor PackagingMelbs LeMieuxBrett WalkerSima HannaniKang-Yu LiuKazutaka OzawaMin-Lung HuangYueh-Lung LinYu-Hsun Chang
- Breaking the Oxide Barrier: Cost-Efficient Plasma De-oxidation of Copper Surfaces for Advanced Hybrid BondingKelvin ChiuKuo-Chao LiangChun-Cheng WuNick ChenWinson Hsu
- Full Field Dishing Metrology for Hybrid Bonding ProcessHugo BiardMatthieu PaquesWolfgang IffAnindita SahooThibault ImbertClémence ChauvetHadrien VergnetVartika BansalDorra SoltaniAngela AlvarezMael WinterMichael SchoetbitzJean-François BoulangerAlain CourtevilleDario Alliata
- Technical Challenges for Ultra Fine Pitch Hybrid BondingCharles G. WoychikJonathan AbdillaChris ScanlanVictor VilarRobert PattiDadi SetiadiHimanandhan Reddy KotturNavid Asadizanjani
- Cu-Cu Hybrid Bonding for Chiplets Heterogeneous IntegrationJohn H Lau
- Development of Panel-Level Packaging Technologies for Next-Generation RF Front-Ends ApplicationsZeyu MaDi HeXiaotian YangGaolin LiBingjie TangYuhang PengTao SunLike Hu
- Design, Fabrication and Analysis of Antenna Elements and Feed Network Structures for the Use in Wrap Around Microstrip Patch Antenna Arrays for 2.3 GHz CommunicationsShiwantha GunathilakeWT Al-Shaibani1D. DemozN. SezginR. Al-HaidariStephen GonyaC.J. TorbittP. GayloT. RovereMark D. Poliks
- Additively Manufactured Module Packaging for Millimeter Wave ApplicationsLucas UngerAndrew LuceAlkim Akyurtlu
- Heterogeneous Integration for Direct RF Digitization: Packaging Strategies for Wideband Software Defined Sensor SystemsHsuanyu (Marcus) PanKen Karcher
- Enhanced Step Coverage and Thermal Suppression in High-Aspect-Ratio Glass TGV via Collimator-Assisted PVDJustin KimJisoo KimDavid LeeRichard Bae
- Advanced Two-Step Filling Approach for High-Aspect-Ratio TGV StructuresDennis FiedlerGrigory VazheninHee-Bum ShinTobias SponholzTatjana KönigsmannDirk RohdeStefanie Ackermann
- Thin Glass Substrates with TGV: Handling and Process AdvancesJoshua RoysDavid LevyKyle LiddleNick StucchiSabina KanjicPatrick BorrelliBrian Harding
- Mechanical and Thermal Performance of CoWoS-S Using Glass-Core Substrate and Glass-InterposerShane LinVito LinAndrew KangD.S. Jiang
- Co-Engineering Packaging Architecture for Next Gen Data Center Xeon SoCSandhya ArikatlaVishal ChandrasekharJudy Amanor-BoaduYanjie ZhuRaul EnriquezArun ChandrasekharAmruthavalli P Alur
- Accelerating Advanced Packaging and Interposer Design with AI-Based 3D Full-Wave OptimizationAaron ChenLawrence Der
- Mechanical Ruggedization of Ceramic Column Grid Array with Polyimide Reinforced Solder ColumnsAlex BrownTom MarinisChristie BielmeierEmily LamportCaroline Bjune
- Improving HDI Substrate Reliability by Suppressing Void Growth in Electroless Cu Plating at Microvia BottomsMing-chun HsiehMasahiko NishijimaAiji SuetakeTakuya NakagiriKimihiro YamanakaYuhei KitaharaJunichi YoshikawaHiroshi NishikawaKatsuaki Suganuma
- Copper Pillar Patterning Using Digital Exposure Technology with Dry Film Resists for 2.5D PLPKsenija VargaLisa BergerTobias ZengerHajime FurutaniMasayuki Kishino
- Takeaway & Assignment of Packaging Technology for Heterogenous + Large Body PackagesHoon Jung
- Reverse Laser Thermo-Compression Bonding (R-LTC) for Simultaneous Thermal Uniformity and Thermomechanical Stress Mitigation in Heterogeneous Chiplet IntegrationWoongpyo LeeMinji KimJongwook LeeByungWon SeoKyungRok Park
- Prediction of Crack Propagation in Large-Area Sintered Ag Joints for Bonding Power Modules and Coolers in Electric Vehicle InvertersTomoya KazumiShinya YanoKenta Emori
- Properties of Fine Bonding WiresSarangapani MuraliTan Tze QingLim Yee (Evonne) WeonDhayalan Mariyappan
- Plasma Chamber Cross Contamination: ToF SIMS Evidence and Its Impact on Wire BondabilityJorell D. Pelingo
- Effects of Laser Ablation on Aluminum Surface Condition and Ultrasonic Bond Interface FormationLouis CastellanosMaxwell HeinMichael BrökelmannMichael McKeownGina Kim
- Reliability Benchmarking Novel Ag-sinter Die-Attach Against High-Pb Solder Under Thermal Cycling and High-Temperature Storage TestingHenry A. MartinB. Senthil KumarFrans G. M. MeeuwsenEdsger C. P. SmitsRuud D. Wit
- Packaging Technologies for Modern High-Reliability Electronics for Harsh EnvironmentAnupam ChoubeyMatthew GordonCaroline BjuneOlivier WikinaTom MarinisDave BedelCasey SkolnikCatie CaseyMark Voss
- The Ideal Switch®: Glass-based Device With Demonstrated ReliabilityAric ShoreyChris KeimelJohn MookkenMark Walker
- Reliability of Additively Manufactured Resistors for High Temperature with Glass EncapsulationErik BusseAbdullah S. ObeidatMousa Al-ZaninaEmuobosa EnakerakpoWT AlshaibaniStephen GonyaMatthew ErdtmannMark Poliks
- Scalable Four-Layer Redistribution Layers via Fully Additive Build-Up: Demonstration of Defect-Free Multilayer IntegrationRoghayeh ImaniShailesh ChouhanJerker Delsing
- Screen-Printable Cellulose Acetate Dielectric Ink for Sustainable Flexible Hybrid Electronics: Thermal, Dielectric, and Reliability CharacterizationOlya Noruz ShamsianBabatunde FalolaAbdullah ObeidatRiadh Al-HaidariBryan CabreraUdara SomarathnaGurvinder Singh KhindaMark Poliks
- Printed Carbon Resistive Strain Sensor for Structural Health MonitoringBabatunde FalolaShiwantha GunathilakeBryan CabreraDavid DemozSophie Schwarz-EiseNafish IslamRiadh Al-HaidariStephen GonyaNikky PathakZebadiah MilesSvetlana BakhmatovaMark D. Poliks
- Additive Magnet Free Circulator for Heterogenous IntegrationAndrew LuceLucas UngerJason AdamsJohn LovassenMary HerndonAlkim Akyurtlu
- Thermal 3D Magnetic Imaging of Advanced PackagesThinh Q. BuiFrank M. AbelPaige BurkeMd Mahadi RajibGary ZabowSolomon I. Woods
- High-resolution 3D Inspection of Bonding Defects in HBM using Optically-coupled X-ray Computed LaminographySung Oh ChoJaeyoung ImMinjun Kim
- Metrology-Driven Sample Preparation for Advanced Microelectronics Using TESCAN FemtoChisel with Intelligent Multigas Processing, LPL, and AI-Enabled Correlative WorkflowsMohammad Taghi Mohammadi AnaeiNicholas MayJosé Rodrigo Delgadillo BlandoMatthew ManiscalcoWesley RoserHongbin ChoiParisa MahyariAdrian PhouladyHerve MacePeyman AhmadiSina ShahbazmohamadiPouya Tavousi
- X-Ray Computed Tomography and Laminography Measurements of a 3D-Stacked ICFelix H. KimOrion KafkaIstiaq F. ShiamAdam L. PintarJohn Henry J. ScottJohn A. WuJessie ZhangNavid Asadizanjani
- Substrate Yield Enhancement Enabled by Advanced Packaging Metrology SystemRobert BishopTim Pinkney
- Wireless Data Transmission from Smart Urinary Catheters Using Additively Manufactured Bluetooth® and NFC AntennasMark D. PoliksWT Al-ShaibaniZhi DouErika SolanoAbdullah ObeidatRiadh A Al-HaidariMousa Al-ZaninaMark J. SchadtDaniel WollinSouvik PaulKara Allanach
- INSIGHT-X: Multimodal VLM Assistant for Artifact Localization, and Mitigation Guidance in X-ray InspectionAntika RoyPratyush ShuklaJunfu ChengShajib GhoshPatrick CraigAkash BalajiMaitrey Vivek PhatakHafez BahramiNavid Asadizanzani
- Low Thermal Damage Laser Lift-off (LLO) Enabling Multi-Cycle Carrier Wafers Reuse for Advanced PackagingJungrae ParkJoshua PeckJoshua HoogeIlseok SonAngelique RaleyYoshihiro KondoSitaram Arkalgud
- Using Superelement Model in Active Thermal Cycle with Temperature Dependent PropertiesJunyan HeHenan MaoAdarsh Chaurasia
- Considerations for Bond Strength Metrology and StandardsRichard. A. AllenJohn P. BieseckerMarcelo DavancoTammy J. LucasSujitra J. PookpanratanaDan R. SchmidtJunyeob Song
- Novel Interconnect Materials for Advanced Packaging Assembly ProcessesSze Pei LimJason ChouChun Wei YangJeffrey LenDongkai Shangguan
- CNN-Based Pressure Prediction for a Hybrid Pneumatic–Electromagnetic Bonding System in the OLED Lamination ProcessEun-Ho LeeTaehun JuHohyun Lee
Williamson, Jaimal, Alex Lampert, Yutaka Suzuki, and Usman Chaudhry. 2026. “Interaction of Laser Assisted Soldering Versus Standard Mass Reflow on FCBGA Assembly Process and Board Level Reliability.” IMAPSource Proceedings 2026 (Symposium): 168–75. https://doi.org/10.4071/001c.173316.