ISSN 2380-4505
Vol. 2026, Issue DPC, 2026August 17, 2026 EDT
Enabling Glass-Based AP and CPO
Enabling Glass-Based AP and CPO
Nils Anspach, Roman Ostholt, Daniel Dunker, Sascha Nehus, Jannis Heinz, Norbert Ambrosius, Ruben Kahle, Andreas Ostmann,
Articles in Vol. 2026, Issue DPC, 2026
Vol. 2026, Issue DPC, 2026
- CPO Growth and OpportunityBrandon Hoff
- SiPh CPO – A Paradigm ShiftJean Trewhella
- Power Packaging for AI/ Data Center from Grid to CoreThorsten Meyer
- Overcoming Critical Challenges in GCS for Next-gen. Chiplet and CPO ApplicationsYoshiki Takahashi
- Adhesives Properties Impact on Optical Alignment and PackagingGarian LimAlexander HartwigS. SeethalerT.X. GuoH. WangO. Matyssek
- Ultra-Thick PR Patterning for High Aspect Ratio Fine Pitch Cu Pillars Enabling Advanced LPDDR PackagingOkseon YoonJeongseok MunJinyoung KimIssei SuzukiTatsuya FujiiJeongju ParkJihye Shim
- Predicting the Thermomechanical and Adhesive Properties of a Layered Polyimide Packaging Material Using Molecular SimulationDavid NicholsonAtif AfzalShaun KwakAndrea R. Browning
- Glass-on-Glass: Unlocking Opportunities for PackagingBill TaylorYunjiang DingLei LiJames Hwang
- Nanoporous Silicon Capacitors for Advanced Power Delivery Networks (PDN)Frederic NodetMounir HedirCatherine Bunel
- AI PDN Performance and Efficiency Improvement Enabled by Saras STILE(TM)Bart DeProspo
- Residue Formation Mechanisms in BGA Ball Mounting on OSP-Coated Cu Pads : Influence of Acid Value of Flux, Thermal Impact, Ball Mounting Process Design, and Incoming Pad ConditionChun Wei Yang
- Suppression of Interfacial Delamination in High-Power Devices by Advanced AP CoatingHidenori Higashi
- DiaCool Embedded IMASanchayan Dutta
- Chemical Resistant Dicing Tape for Hybrid Bonding ProcessRyoh TakahashiKoki MarunoKazutoshi FuruzonoNaoki TakaharaSeiji Kai
- Development of Thick High Aspect Ratio Plating Resist TechnologyJenna CorderoLori RattrayDaniel Nawrocki
- B-stageable Conductive Adhesive for Reliable Ceramic Package AssemblyJochen SchuermansMarco DelsartoTamara Bunkens
- Chiplets & Advanced IC PackagingMike Kelly
- Photonic Interconnects & Co-Packaged OpticsPrahalad Parthangal
- Cost Analysis of Panel-level Packaging for HPC and AI ApplicationsAmy Lujan
- Advanced Dielectric Polymer Development at Kayaku Advanced MaterialsAaron A. RachfordJenna CorderoChristopher DiminoQing Min WangLori RattrayCarolyn BakerNicholas SchneiderDaniel J. Nawrocki
- Plasma -Induced Metal Oxide Reduction for Improved Intermetallic Contact Performance in Packaging ApplicationsDaphne PappasTerry DunbarDhia BensalemYaser HamediRyan RobinsonNico CoenenStephanie Schweiger
- Production-Proven Chemical-Free Green Alternative to Solvent and Piranha Wafer Processing using OzonePhillip SundinJohn Ghekiere
- RAM Embedded Die Packaging (EDP) Experts in Heterogeneous Advanced Packaging (AP)Peter Green
- Maskless Additive Fine-Pitch Interconnects and Wire Bond Replacement for Advanced PackagingPatrick HeisslerPatrick Galliker
- Reliability Evaluation for Realizing Panel-Level Packaging for AI/Data Centers and VehiclesKatsuhiro TakaoYuki MatsueYuichi FujimotoTakashi SuzukiYoshiaki Aizawa
- High-Reliability Fine-Pitch RDL on Glass with Superior Electrical Performance for Heterogeneous IntegrationTakamasa Takano
- Revolutionizing Microelectronics: An Innovative Hybrid Evaluation of Pure Argon Plasma in Advancing Wire Bond Performance and Manufacturing EfficiencyJorell Pelingo
- Enabling Advanced Sensor Architectures in Medical, Life Science, and ImagingRichard NoackOliver FoellmerStefan ErnstSteffen LeopoldGuillaume Wong
- Defect-Free Cu-AI Interconnects: Enhancing Automotive Reliability via Dual-Metal PassivationShinoj Sridharan NairDinesh Kumar KumaravelPavan AhluwaliaKhanh Tuyet Anh TranDuwage Anushka Sandaruwan PereraShyam Muralidharan NairOliver Chyan
- Indium Bump Interconnect (IBI) Flip Chip BondingDmitry Padrubny
- Advancing Low-Temperature Hybrid Bonding via Tailored Copper Microstructure EngineeringJobert van EisdenChristian WendelnDirk Tews
- Process Integration of Direct Al-Cu Bonding Toward Heterogeneous Integration of 22nm CMOS FDSOI in Advanced RF PackagingKirthika NahalingamMohammad RezaeiferKamran EntesariLinda Katehi
- Demonstration of <5nm Overlay Distortion for Backside Power Delivery Through Control of Wafer Conditions and ProcessingChristopher NetzbandAndrew TuchmanSheldon MeyersNathan IpIlseok SonAngelique Raley
- Panel-Level Fan-Out QFN for Scalable & Reliable ManufacturingVeronicalyn AbellaBenedict San JoseCliff SandstromAndy Kovats
- Warpage Modeling and Neural Network-Assisted Optimization of Molded Core SubstratesPallavi JithendrriyanGeorgios DogiamisAbhijit DasguptaChristopher Bailey
- Development of TSV Interposer for Control and Readout of Superconducting Quantum Annealing CircuitsN. WatanabeY. AragaA. YamaguchiS. TsukiyamaK. IshiharaT. NishiyamaK. Kikuchi
- High Adhesion Glass Seed Process for Glass Core Packages Using Metal Oxide as Binder LayerKazuhiro HirookaKeita ArikiyoYuka IwamotoSoichiro KanoKyosei KuribayashiMasayuki SakoguchiHonoka NakagawaMayu TsukudaJun-ichi Katayama
- 1um Multi-Layer High Density Build Up (HDBU) SubstratesDouglas Hackler
- Thin-Film Deposition for Large Size Packages on Panel ScaleMarkus Frei
- Enabling Glass-Based AP and CPONils AnspachRoman OstholtDaniel DunkerSascha NehusJannis HeinzNorbert AmbrosiusRuben KahleAndreas Ostmann
- Scalable Density Advancement in Embedded Bridge Interposers through Adaptive Patterning® and Adaptive Pad StacksCliff SandstromBenedict San JoseErick TalainJen-Kuang FangPing-Feng YangSheng-Feng HuangPing-Ching Shen
- Enabling Next Generation Packaging with Glass Core Substrates: Material, TGV and Metallization RequirementsJonas Discher
- High-Resolution Stereolithography-Based Printing of 3D Chip PackagingHylke Akkerman
- 3D-Printed Ceramic Structural Electronics: Integrating Function into FormEric MacDonaldAlexander GomezTenzin LhadenJoshua DantzlerYirong LinTzu-Liang (Bill) Tseng
- Ultrabroadband mmWave/sub-THz Devices for System-on-Package Platforms in the Era of Micro-Additive ManufacturingGenaro Soto ValleFernando PastranaHani Al JamalManos M. Tentzeris
- Inkjet Printing for Advanced PackagingJohannes Menath
- Multi-die Wirebond Development of S32E Automotive Real-Time ProcessorSivasakthya MohanMeijiang SongTu-Anh TranZhanbin SongWei GaoJetse de WitteHuanhuan LiuStephen LeeMun Leit ChaiZahiri Aziz
- Cost-Effective High-Performance Flip Chip MicroLeadFrame®(fcMLF®) PackageKyungSu Kim
- Reducing Wafer-to-Wafer Bonding Misalignment to Enable 140nm Pitch Hybrid BondingAndrew TuchmanChristopher NetzbandJoshua GreklekShinichi TanYuki TaniguchiNathan IpAtsushi NagataIlseok SonAngelique Raley
- Physics Based Analysis of Electromigration Lifetime in Ruthenium and Copper InterconnectsJakob RamosShubhra Bansal
- Advanced Packaging Market Trends in the AI EraGabriela Pereira
- SHIELD USA: Leap-Ahead Organic Substrate Enabled by Fan-Out Technology, Domestic Materials, Process Innovations, and Novel EDA WorkflowsGeorgios DogiamisStanislau NiauzorauGreg JohnsonMatt MagnavitaMike NaujokaitisTim TakeuchiLeslie HwangChris BaileyCraig BishopJason Conrad
- Integrating Thin Film Resistors into Organic Substrates for Module and Integrated Circuit (IC)Packaging-The latest results.John AndresakisOhmega TicerAndreas Schilloff
- Glass Core Substrates for High-Density Chiplet IntegrationLars Böttcher
- Thermo Mechanical Reliability of Through Glass Vias: Modelling, Material Design and Process Co-optimizationPoulomi Mukherjee
- On-Shore Manufacturing of Fan Out Wafer Level Packaging (FOWLP) at 300mm Wafer Size with Fine Redistribution Layers for High-Bandwidth InterconnectsSuresh YeruvaFrank WangDavid Box
- Microstructural Characterization for Bottom Joint of Stacked Micro-via Integrated in a SubstrateK. SuganumaM. NishijimaM.-C. HsiehR. OkumuraH. YoshidaC. ChenA. SuetakeK. YamanakaH. SetoY. KitaharaK. Hashizume
- A Novel Perspective and Methodology on Evaluating the Reliability and Strength of 12-inch Wafer Level Glass CarriersWu-Lung WangYu-Sheng HsiaoWiwy WudjudYi-Hsuan TsaiChin-Li KaoChen-Chao WangLihong CaoChieh LoChih-Pin Hung
- Enabling AI and HPC: Defect-Free, Co-Planar Copper via fill Plating process for Advanced IC SubstratesSam Dharmarathna
- A Copper Interconnect Scaling Roadmap for AI and HPC SystemsSebastiaan MullerRobin DavisBen Wilkinson
- Reengineering Core Packages for Automotive: Materials, Design, and Interconnect EvolutionPrasad Dhond
- Water-proof Barometric Range Pressure Sensor Package Structure and ProcessMarco Del SartoLuca MaggiLuca AimoneAlastair Attard
- Advanced MEMS Packaging based on Parylene: One Material Enabling Encapsulation, Wafer and Chip Bonding, as well as Ultra-thin Flexible Printed Circuit BoardsFranz SelbmannMartin KühnFlorian GlaucheFrank RoscherMaik Wiemer
- Design of MEMS Multiplexer for SiNW-based SensorsBruce Kim
- Driving Process Agility and Innovation for Advanced Packaging: Role of Universal Carriers for Singulated DieJerry BrozVictoria TranRaj Varma
- Innovations in Die Side Capacitor Protection for Enhanced AI and HPC PerformanceChristian Haltenberger
- Reuse and Characterization of Laser Lift-off (LLO) of Bonded Wafers for Advanced PackagingJoshua PeckJungrae ParkJoshua HoogeIlseok Son
Anspach, Nils, Roman Ostholt, Daniel Dunker, Sascha Nehus, Jannis Heinz, Norbert Ambrosius, Ruben Kahle, and Andreas Ostmann. 2026. “Enabling Glass-Based AP and CPO.” IMAPSource Proceedings 2026 (DPC): 561–82. https://doi.org/10.4071/001c.167501.