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EMPC Conference Proceedings (IMAPS Europe)
Vol. 2023, Issue EMPC, 2023March 07, 2024 EDT

Ceramic Embedding of SiC-Semiconductor Using Cofiring Technology

Steffen Ziesche, Kathrin Reinhardt, Jobin Varghese, Birgit Manhica, Andreas Schletz,
power electronicsembeddingSiCLTCCULTCCMultilayer Ceramics
https://doi.org/10.4071/001c.94855
IMAPSource Conference Papers
Ziesche, Steffen, Kathrin Reinhardt, Jobin Varghese, Birgit Manhica, and Andreas Schletz. 2024. “Ceramic Embedding of SiC-Semiconductor Using Cofiring Technology.” IMAPSource Proceedings 2023 (EMPC): 419–23. https:/​/​doi.org/​10.4071/​001c.94855.
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