Vol. 2023, Issue EMPC, 2023March 07, 2024 EDT
Ceramic Embedding of SiC-Semiconductor Using Cofiring Technology
Ceramic Embedding of SiC-Semiconductor Using Cofiring Technology
Ziesche, Steffen, Kathrin Reinhardt, Jobin Varghese, Birgit Manhica, and Andreas Schletz. 2024. “Ceramic Embedding of SiC-Semiconductor Using Cofiring Technology.” IMAPSource Proceedings 2023 (EMPC): 419–23. https://doi.org/10.4071/001c.94855.