Vol. 2023, Issue EMPC, 2023March 07, 2024 EDT
20 μm Copper Micro-Bump Bonding Through a Silver Metallization for Advanced Packaging Under a Low Pressure Condition
20 μm Copper Micro-Bump Bonding Through a Silver Metallization for Advanced Packaging Under a Low Pressure Condition
Zhang, Zheng, Ming-Chun Hsieh, Aiji Suetake, Hiroshi Yoshida, Rieko Okumuara, Noriko Kagami, Kazamasa Okamoto, et al. 2024. “20 Μm Copper Micro-Bump Bonding Through a Silver Metallization for Advanced Packaging Under a Low Pressure Condition.” IMAPSource Proceedings 2023 (EMPC): 416–18. https://doi.org/10.4071/001c.94854.