20 μm Copper Micro-Bump Bonding Through a Silver Metallization for Advanced Packaging Under a Low Pressure Condition

Zheng Zhang; Ming-Chun Hsieh; Aiji Suetake; Hiroshi Yoshida; Rieko Okumuara; Noriko Kagami; Kazamasa Okamoto; Chuantong Chen; Kei Hashizume; Norihiko Hasegawa; Ryuji Yoshida; Hidekazu Homma; Katsuaki Suganuma

doi:10.4071/001c.94854

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Zhang, Zheng, Ming-Chun Hsieh, Aiji Suetake, Hiroshi Yoshida, Rieko Okumuara, Noriko Kagami, Kazamasa Okamoto, et al. 2024. “20 Μm Copper Micro-Bump Bonding Through a Silver Metallization for Advanced Packaging Under a Low Pressure Condition.” IMAPSource Proceedings 2023 (EMPC): 416–18. https://doi.org/10.4071/001c.94854.

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