Application of Reactive Bonding Methods on LTCC Substrates

Erik Wiss; Alexander Schulz; Adam Yuile; Jens Mueller; Steffen Wiese

doi:10.4071/001c.94848

Wiss, Erik, Alexander Schulz, Adam Yuile, Jens Mueller, and Steffen Wiese. 2024. “Application of Reactive Bonding Methods on LTCC Substrates.” IMAPSource Proceedings 2023 (EMPC): 394–99. https://doi.org/10.4071/001c.94848.

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