Application of Reactive Bonding Methods on LTCC Substrates

Wiss, Erik, Alexander Schulz, Adam Yuile, Jens Mueller, and Steffen Wiese. 2024. “Application of Reactive Bonding Methods on LTCC Substrates.” IMAPSource Proceedings 2023 (EMPC): 394–99. https:/​/​doi.org/​10.4071/​001c.94848.