Thickness Effect of Copper Clips on Power Module Packaging Design

Haiyong Wan; Nikolaos Iosifidis; Xu Zhang; Rui Rong; Marina Antoniou; Philip Mawby

doi:10.4071/001c.94846

Wan, Haiyong, Nikolaos Iosifidis, Xu Zhang, Rui Rong, Marina Antoniou, and Philip Mawby. 2024. “Thickness Effect of Copper Clips on Power Module Packaging Design.” IMAPSource Proceedings 2023 (EMPC): 381–85. https://doi.org/10.4071/001c.94846.

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Thickness Effect of Copper Clips on Power Module Packaging Design

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