Analysis of the Impact of Environmental Conditions on the Reliability in 5G PCB Assemblies

Hans Walter; Olaf Wittler; Marius van Dijk; Saskia Huber; Julia-Marie Köszegi; Martin Schneider-Ramelow

doi:10.4071/001c.94843

Walter, Hans, Olaf Wittler, Marius van Dijk, Saskia Huber, Julia-Marie Köszegi, and Martin Schneider-Ramelow. 2024. “Analysis of the Impact of Environmental Conditions on the Reliability in 5G PCB Assemblies.” IMAPSource Proceedings 2023 (EMPC): 374–80. https://doi.org/10.4071/001c.94843.

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Analysis of the Impact of Environmental Conditions on the Reliability in 5G PCB Assemblies

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