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EMPC Conference Proceedings (IMAPS Europe)
Vol. 2023, Issue EMPC, 2023March 07, 2024 EDT

Laser-Assisted Bonding Approach for Photonic Integration Processes

Aleksandr A. Vlasov, Topi Uusitalo, Evgenii Lepukhov, Heikki Virtanen, Samu-Pekka Ojanen, Jukka Viheriälä, Mircea Guina,
assembly processeslaser-assisted bondingphotonic integrationsilicon devicessilicon photonicsthroughsilicon visioninfrared imaginginfrared microscopy
https://doi.org/10.4071/001c.94841
IMAPSource Conference Papers
Vlasov, Aleksandr A., Topi Uusitalo, Evgenii Lepukhov, Heikki Virtanen, Samu-Pekka Ojanen, Jukka Viheriälä, and Mircea Guina. 2024. “Laser-Assisted Bonding Approach for Photonic Integration Processes.” IMAPSource Proceedings 2023 (EMPC): 370–73. https:/​/​doi.org/​10.4071/​001c.94841.
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