Vol. 2023, Issue EMPC, 2023March 07, 2024 EDT
Laser-Assisted Bonding Approach for Photonic Integration Processes
Laser-Assisted Bonding Approach for Photonic Integration Processes
Aleksandr A. Vlasov, Topi Uusitalo, Evgenii Lepukhov, Heikki Virtanen, Samu-Pekka Ojanen, Jukka Viheriälä, Mircea Guina,
Vlasov, Aleksandr A., Topi Uusitalo, Evgenii Lepukhov, Heikki Virtanen, Samu-Pekka Ojanen, Jukka Viheriälä, and Mircea Guina. 2024. “Laser-Assisted Bonding Approach for Photonic Integration Processes.” IMAPSource Proceedings 2023 (EMPC): 370–73. https://doi.org/10.4071/001c.94841.