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EMPC Conference Proceedings (IMAPS Europe)
Vol. 2023, Issue EMPC, 2023March 07, 2024 EDT

Measurement and Simulation of Mechanical Strength of Back-End-Of-Line Layer in Advanced CMOS Dies

Bart Vandevelde, Kevin Cox, Reza Moloudi, Riet Labie, Jason Krantz, Matt Borden, Kris Vanstreels, Mario Gonzalez,
BEOLthermo-mechanical stressflip chip assemblies
https://doi.org/10.4071/001c.94836
IMAPSource Conference Papers
Vandevelde, Bart, Kevin Cox, Reza Moloudi, Riet Labie, Jason Krantz, Matt Borden, Kris Vanstreels, and Mario Gonzalez. 2024. “Measurement and Simulation of Mechanical Strength of Back-End-Of-Line Layer in Advanced CMOS Dies.” IMAPSource Proceedings 2023 (EMPC): 360–64. https:/​/​doi.org/​10.4071/​001c.94836.
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