Vol. 2023, Issue EMPC, 2023March 07, 2024 EDT
Measurement and Simulation of Mechanical Strength of Back-End-Of-Line Layer in Advanced CMOS Dies
Measurement and Simulation of Mechanical Strength of Back-End-Of-Line Layer in Advanced CMOS Dies
Vandevelde, Bart, Kevin Cox, Reza Moloudi, Riet Labie, Jason Krantz, Matt Borden, Kris Vanstreels, and Mario Gonzalez. 2024. “Measurement and Simulation of Mechanical Strength of Back-End-Of-Line Layer in Advanced CMOS Dies.” IMAPSource Proceedings 2023 (EMPC): 360–64. https://doi.org/10.4071/001c.94836.