Vol. 2023, Issue EMPC, 2023March 07, 2024 EDT
Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging
Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging
Singh, Prashant Kumar, Patrick Rohlfs, Gunther Sandmann, Kashi Vishwanath Machani, Dirk Breuer, Karsten Meier, Frank Kuechenmeister, Marcel Wieland, and Karlheinz Bock. 2024. “Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging.” IMAPSource Proceedings 2023 (EMPC): 345–50. https://doi.org/10.4071/001c.94832.