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EMPC Conference Proceedings (IMAPS Europe)
Vol. 2023, Issue EMPC, 2023March 07, 2024 EDT

Deposition of Fine-Pitch Indium Bumps on Single Die

Andreas Schneider, Navid Ghorbanian, David Burt, James Hollingham, Paul Booker, Toby G. Brooks, John D. Lipp, Marcus J. French,
shadow maskindium bumpsflip-chip bondingfine-pitchradiation detectors
https://doi.org/10.4071/001c.94827
IMAPSource Conference Papers
Schneider, Andreas, Navid Ghorbanian, David Burt, James Hollingham, Paul Booker, Toby G. Brooks, John D. Lipp, and Marcus J. French. 2024. “Deposition of Fine-Pitch Indium Bumps on Single Die.” IMAPSource Proceedings 2023 (EMPC): 324–28. https:/​/​doi.org/​10.4071/​001c.94827.
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