Vol. 2023, Issue EMPC, 2023March 07, 2024 EDT
Effect of Surface Microstructure on Joints Using Nanoporous Cu Sheet for Power Devices
Effect of Surface Microstructure on Joints Using Nanoporous Cu Sheet for Power Devices
Nishikawa, Hiroshi, Byungho Park, Mikiko Saito, and Jun Mizuno. 2024. “Effect of Surface Microstructure on Joints Using Nanoporous Cu Sheet for Power Devices.” IMAPSource Proceedings 2023 (EMPC): 285–88. https://doi.org/10.4071/001c.94817.