Effect of Surface Microstructure on Joints Using Nanoporous Cu Sheet for Power Devices

Hiroshi Nishikawa; Byungho Park; Mikiko Saito; Jun Mizuno

doi:10.4071/001c.94817

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Nishikawa, Hiroshi, Byungho Park, Mikiko Saito, and Jun Mizuno. 2024. “Effect of Surface Microstructure on Joints Using Nanoporous Cu Sheet for Power Devices.” IMAPSource Proceedings 2023 (EMPC): 285–88. https://doi.org/10.4071/001c.94817.

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