Vol. 2023, Issue EMPC, 2023March 07, 2024 EDT
Application of Machine Learning Methods for Process Optimization in Electronic Packaging Processes
Application of Machine Learning Methods for Process Optimization in Electronic Packaging Processes
Niegisch, Corinna, Sabine T. Haag, Tanja Braun, Ole Hoelck, and Martin Schneider-Ramelow. 2024. “Application of Machine Learning Methods for Process Optimization in Electronic Packaging Processes.” IMAPSource Proceedings 2023 (EMPC): 279–84. https://doi.org/10.4071/001c.94815.