Enhanced Reliability for Power Modules via a New Ag/Si Sinter Joining Strategy

Yang Liu; Chuantong Chen; Koji S. Nakayama; Minoru Ueshima; Takeshi Sakamoto; Naoe Takuya; Hiroshi Nishikawa; Katsuaki Suganuma

doi:10.4071/001c.94762

Liu, Yang, Chuantong Chen, Koji S. Nakayama, Minoru Ueshima, Takeshi Sakamoto, Naoe Takuya, Hiroshi Nishikawa, and Katsuaki Suganuma. 2024. “Enhanced Reliability for Power Modules via a New Ag/Si Sinter Joining Strategy.” IMAPSource Proceedings 2023 (EMPC): 242–44. https://doi.org/10.4071/001c.94762.

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