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EMPC Conference Proceedings (IMAPS Europe)
Vol. 2023, Issue EMPC, 2023March 06, 2024 EDT

Thermal Design of Stacked Power Modules for Electric Drive Applications

Jianfeng Li, Yuekang Du, Xingzhi Wang, Liangjie Liu, Yong Pang, Feixiang Liu,
IGBT moduleheat sinkdouble side coolingstacked structuresimulationthermal test
https://doi.org/10.4071/001c.94761
IMAPSource Conference Papers
Li, Jianfeng, Yuekang Du, Xingzhi Wang, Liangjie Liu, Yong Pang, and Feixiang Liu. 2024. “Thermal Design of Stacked Power Modules for Electric Drive Applications.” IMAPSource Proceedings 2023 (EMPC): 236–41. https:/​/​doi.org/​10.4071/​001c.94761.

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